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A kind of preparation method of high-purity active electroplating grade copper oxide powder

A technology of electroplating grade copper oxide and copper oxide powder, applied in copper oxide/copper hydroxide and other directions, can solve the problems of difficulty in obtaining copper oxide powder with uniform particle size, uncontrollable product particle size, complicated equipment and technology, etc. The agglomeration effect is improved, the grain growth is prevented, and the grain size is small.

Active Publication Date: 2016-05-18
昆山德阳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the production methods of copper oxide powder mainly include: 1) Copper oxide powder is obtained by calcining and decomposing inorganic salts such as copper sulfate under high temperature conditions. This method has simple process and low cost, but the particle size of the product cannot be controlled, and it is difficult to obtain uniform particle Copper oxide powder, and the sulfide produced in the production process is harmful to the environment, and its application is limited
2) The copper in the molten state is sprayed at 1300°C by spraying to form copper oxide powder with oxygen in the air. The equipment and technology of this production method are complicated, and the produced copper oxide powder has a large particle size, which is subject to domestic use. limit

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for preparing high-purity active electroplating grade copper oxide powder specifically includes the following steps:

[0028] (1) Add copper sulfate powder with a purity of 99wt% and pure water with a chlorine content of less than 1ppm in the first reactor, stir to dissolve, and then heat to 100°C and keep it warm to obtain a copper sulfate solution. The mass fraction of copper in the copper sulfate solution is 9%;

[0029] (2) Prepare a sodium hydroxide solution with a mass concentration of 50% in the second reactor, and then heat it to 100°C and keep it warm to prepare an alkali solution;

[0030] (3) The copper sulfate solution of step (1) and the alkali solution of step (2) are respectively passed through the first pressurized spray system with a pressure of 1Mp and the second pressurized spray system with a pressure of 1Mp into the third reactor so that The materials after atomization are fully contacted. The raw materials added to the third reactor are added in...

Embodiment 2

[0037] A method for preparing high-purity active electroplating grade copper oxide powder specifically includes the following steps:

[0038] (1) Add copper sulfate powder with a purity of 99.2wt% and pure water with a chlorine mass content of less than 1ppm in the first reactor, stir to dissolve, and then heat to 40°C and keep it warm to prepare a copper sulfate solution. The mass fraction of copper in the copper sulfate solution is 11%;

[0039] (2) Prepare a potassium hydroxide solution with a mass concentration of 20% in the second reactor, and then heat it to 40°C and keep it warm to prepare an alkaline solution;

[0040] (3) The copper sulfate solution of step (1) and the alkali solution of step (2) are respectively passed through the first pressurized spray system with a pressure of 2Mp and the second pressurized spray system with a pressure of 2Mp into the third reactor so that The materials after atomization are fully contacted. The raw materials added to the third reactor ...

Embodiment 3

[0047] A method for preparing high-purity active electroplating grade copper oxide powder specifically includes the following steps:

[0048] (1) Add copper sulfate powder with a purity of 99.5 wt% and pure water with a chlorine mass content of less than 1 ppm into the first reactor, stir to dissolve, and then heat to 50°C and keep warm to prepare a copper sulfate solution. The mass fraction of copper in the copper sulfate solution is 11%;

[0049] (2) Prepare a potassium hydroxide solution with a mass concentration of 15% in the second reactor, and then heat it to 50°C and keep it warm to prepare an alkali solution;

[0050] (3) The copper sulfate solution of step (1) and the alkali solution of step (2) are respectively passed through the first pressurized spray system with a pressure of 3Mp and the second pressurized spray system with a pressure of 3Mp into the third reactor so that The materials after atomization are fully contacted. The raw materials added to the third reactor a...

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Abstract

The invention relates to a preparation method of high-purity active plating grade copper oxide powder. The preparation method comprises the following steps: firstly preparing copper sulfate solution and alkali solution of sodium hydroxide or potassium hydroxide, then respectively introducing the copper sulfate solution and the alkali solution into a reactor through a first pressurized spray system and a second pressurized spray system for mixing, and adding raw materials to the reactor according to a proportion which enables the pH value of a mixed material to be between 8 and 12; after material addition is stopped, carrying out stirring reaction on the mixed material at 40-100 DEG C for 30-60 minutes, then carrying out pressure filtration on a reacted material, and washing to be neutral to obtain a reaction product filter cake; then drying, calcining and screening the reaction product filter cake to prepare the copper oxide powder. The copper oxide prepared through the preparation method disclosed by the invention is uniform in granularity, high in bulk ratio and low in impurity content.

Description

Technical field [0001] The invention relates to a method for preparing copper oxide powder, in particular to a method for preparing high-purity active electroplating grade copper oxide powder using copper sulfate as a raw material. Background technique [0002] Copper sulfate has a wide range of applications. It can be used in the inorganic industry to produce other copper salts. Copper sulfate can be used as a catalyst for the synthesis of spices and dye intermediates in the organic industry; it can be used as a fungicide in the field of pesticides; it can be used as the main salt for bright acid copper plating in the electroplating industry. Copper ion additive; is an important chemical raw material. [0003] Copper oxide powder is widely used in circuit board electroplating, electronic industries, ceramics, glass pigments, organic synthesis catalysts, artificial gems, gas analysis and rayon production. [0004] The current production methods of copper oxide powder mainly include:...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01G3/02
CPCC01G3/02C01P2004/62C01P2004/64C01P2006/80
Inventor 廖奕坤骆冬冬
Owner 昆山德阳新材料科技有限公司
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