Circuit board and manufacturing method thereof

Abstract

The invention discloses a circuit board. The circuit board comprises a circuit substrate, a conductive polymeric membrane layer and a copper plating shielding layer, wherein the circuit substrate comprises a conductive circuit layer and a third insulating layer; the conductive circuit layer and the conduction circuit layer are formed on the two opposite sides of the third insulating layer; the conductive circuit layer comprises a signal circuit and a grounding circuit; the copper plating shielding layer is formed on the surface of the copper plating shielding layer in an electroplating way; a second conductive hole is formed in the third insulating layer; the grounding circuit is electrically connected to the copper plating shielding layer through the second conductive hole. The invention also provides a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] Due to the thinner and thinner requirements of the flexible circuit board, when the internal circuit is used as the signal line for external signal transmission, it is usually necessary to use conductive silver foil (EMI shielding film) to cover the outer layer of the flexible circuit board to prevent interference caused by external electromagnetic interference. Signal loss. [0003] Conductive silver foil usually has a four-layer structure, namely protective film, metal film, conductive adhesive and release film. Before bonding, the release film needs to be removed to combine the conductive adhesive with the flexible circuit board. In the obtained product, in order to enable the metal film to be closely combined with the flexible circuit board, it is necessary to first attach the conducti...

AI Technical Summary

Problems solved by technology

In the obtained product, in order to make the metal film tightly bonded to the flexible circuit board, it is necessary to first attach the conductive silver foil to the circuit board and then perform thermal compression bonding, which increases the time for circuit board production

Moreover, the conductive silver foil is relatively fragile, and it is easy to be scrapped during the bonding process, thereby increasing the production cost of the circuit board

Further, the price of conductive silver foil is more expensive, resulting in higher production costs of circuit boards

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