A kind of tough high-strength epoxy resin potting compound and its preparation method and application

A technology of epoxy resin and potting compound, which is applied in epoxy resin glue, chemical instruments and methods, and other chemical processes, etc. High rigidity and other problems, to solve the cracking of the adhesive layer, avoid excessive curing stress, and increase flexibility

Active Publication Date: 2016-05-25
CHINA AIR TO AIR MISSILE INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the rigidity of epoxy resin is high, it is easy to damage electronic components and leads, and the high and low temperature impact toughness is poor, the adhesive layer is easy to crack, and the dimensional stability caused by thermal expansion and contraction at high and low temperatures is poor, which makes electrical signals prone to drift
In the prior art, the toughening of epoxy resin is achieved through physical or chemical methods, but the strength is reduced

Method used

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  • A kind of tough high-strength epoxy resin potting compound and its preparation method and application

Examples

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Effect test

Embodiment 1

[0028] The tough and high-strength epoxy resin potting compound of this embodiment is made of the following components in parts by mass: 100 parts of E-51 epoxy resin, 15 parts of hexamethylenediamine, T L 20 parts of 1210 liquid polysulfide rubber, 10 parts of PY-30 glycidyl ether.

[0029] Wherein E-51 epoxy resin was purchased from Shanghai Resin Factory Co., Ltd.; T L 1210 liquid polysulfide rubber was purchased from Jinxi Chemical Factory; PY-30 glycidyl ether was purchased from Zhonghao Chenguang Chemical Research Institute Co., Ltd.

[0030] The preparation method of the tough high-strength epoxy resin potting compound in this embodiment is:

[0031] 1) Weigh E-51 epoxy resin, PY-30 glycidyl ether, T L 1210 liquid polysulfide rubber, fully stirred evenly, and then placed in an oven at 62°C for about 50 minutes to prepare rubber material A;

[0032] 2) Take out the compound A and cool it to room temperature, add hexamethylenediamine in proportion, stir well, and place...

Embodiment 2

[0036] The tough and high-strength epoxy resin potting compound of this embodiment is made of the following components in parts by mass: 95 parts of E-51 epoxy resin, 14 parts of hexamethylenediamine, T L 18 parts of 1210 liquid polysulfide rubber, 9 parts of PY-30 glycidyl ether.

[0037] Wherein E-51 epoxy resin was purchased from Shanghai Resin Factory Co., Ltd.; T L 1210 liquid polysulfide rubber was purchased from Jinxi Chemical Factory; PY-30 glycidyl ether was purchased from Zhonghao Chenguang Chemical Research Institute Co., Ltd.

[0038] The preparation method of the tough high-strength epoxy resin potting compound in this embodiment is:

[0039] 1) Weigh E-51 epoxy resin, PY-30 glycidyl ether, T L 1210 liquid polysulfide rubber, fully stirred evenly, and then placed in an oven at 55°C for about 60 minutes to prepare rubber material A;

[0040] 2) Take out the compound A and cool it to room temperature, add hexamethylenediamine in proportion, stir well, and place i...

Embodiment 3

[0044] The tough and high-strength epoxy resin potting compound of this embodiment is made of the following components in parts by mass: 105 parts of E-51 epoxy resin, 16 parts of hexamethylenediamine, T L 22 parts of 1210 liquid polysulfide rubber, 11 parts of PY-30 glycidyl ether.

[0045] Wherein E-51 epoxy resin was purchased from Shanghai Resin Factory Co., Ltd.; T L 1210 liquid polysulfide rubber was purchased from Jinxi Chemical Factory; PY-30 glycidyl ether was purchased from Zhonghao Chenguang Chemical Research Institute Co., Ltd.

[0046] The preparation method of the tough high-strength epoxy resin potting compound in this embodiment is:

[0047] 1) Weigh E-51 epoxy resin, PY-30 glycidyl ether, T L 1210 liquid polysulfide rubber, fully stirred evenly, and then placed in an oven at 65°C for about 45 minutes to prepare rubber material A;

[0048] 2) Take out the compound A and cool it to room temperature, add hexamethylenediamine, stir well, and place it under vacu...

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Abstract

The invention discloses a tough high strength epoxy resin potting material and a preparation method and application thereof, and belongs to the technical field of potting. The tough high strength epoxy resin potting material is prepared by compounding epoxy resin, hexanediamine, polysulfide rubber and glycidyl ether, the raw materials are easy to obtain, and the tough high strength epoxy resin potting material can be used in large scale for potting sophisticated electronic devices, and can effectively solve the problems of rubber layer cracking at high and low temperature, device damages, signal drift and the like. The preparation method of the tough high strength epoxy resin potting material has the advantages of simple operation, easy control, and suitability for industrialized popularization and application. The tough high strength epoxy resin potting material is used for potting electronic components, avoids damage and pulling destruction caused by excessive curing stress in the potting process of the electronic components, and has no cracks in high and low temperature change process, the electronic components and lead wires have no damage, and electrical signals do not drift.

Description

technical field [0001] The invention relates to the technical field of potting compound, in particular to a tough and high-strength epoxy resin potting compound and its preparation method and application. Background technique [0002] Room temperature curing epoxy resin potting compound is widely used in the bonding, potting and encapsulation of electronic components due to its good mechanical properties, thermal stability and cohesiveness. Anti-counterfeiting and so on played an important role. However, due to the further development of electronic technology, the packaging requirements are getting higher and higher. In addition to the functions of fixing, moisture-proof, and anti-counterfeiting, it also requires high-temperature resistance and other properties. [0003] However, the rigidity of epoxy resin is high, it is easy to damage electronic components and leads, and the high and low temperature impact toughness is poor, the adhesive layer is easy to crack, and the di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J181/04C09J11/06C09K3/10
Inventor 苗蓉丽闫素云李松王斌
Owner CHINA AIR TO AIR MISSILE INST
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