Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Abstract

[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cutting is small; and an adhesive composition for resin-bonded wire saws that is suitable for said method. [Solution] This method for producing a resin-bonded wire saw comprises: a step of applying, to the surface of a metal core wire, a paste including an adhesive composition, abrasive grains, and a solvent for dissolving the adhesive composition, said adhesive composition being used for producing resin-bonded wire saws in which abrasive grains are firmly fixed to the surface of a metal core wire by means of a resin bond, said adhesive composition for resin-bonded wire saws including, as essential components, 100 parts by weight of a novolac-type phenolic resin, 10-30 parts by weight of a resol-type phenolic resin, and 0.1-5 parts by weight of an amine-based silane coupling agent; and a heating step of heating the applied paste with infrared rays including near-infrared rays, and causing said adhesive composition to undergo a cross-linking reaction.

Description

technical field [0001] The present invention relates to solar cell / electronic substrates represented by wafers cut from large-diameter silicon ingots, compound semiconductor substrates such as gallium arsenide, or magnetic / optical components such as magnets, crystals, and glass. Fixed-abrasive wire saws used for cutting substrates, etc., especially related to fixed-abrasive wire saws suitable for precision cutting of hard and brittle materials, which relate to resin-bonded wire saws A method of manufacturing a wire saw bonded to a wire and an adhesive composition used in the manufacturing method. Background technique [0002] For the cutting of silicon ingots for TFT (thin film transistor) applications and solar cell applications, which have been increasing in diameter year by year, the inner peripheral sharpening stone (ID blade) that has been used has been pointed out to be low in processing efficiency and productivity, resulting in processing improvements. There are prob...

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Problems solved by technology

On the other hand, it is pointed out that due to the low holding power of the resin, the diamonds fall off one after another during the cutting process, the sharpness is easily reduced, the wire diameter is thinned, and the life is short.

In addition, when using a thermosetting resin adhesive, the curing cannot be carried out in a short time, and when it is carried out at a high temperature, there are failures such as foaming due to the decomposition of the curing agent and the volatile components accompanying the reaction. Therefore, there is a problem that the speed of wire saw manufacturing cannot be realized.

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