Preparation method of carbon-clad copper electronic paste

Abstract

The invention discloses a preparation method of carbon-clad copper electronic paste. The preparation method includes: mixing formaldehyde and micron copper powder into mixed solvent A, heating and stirring nonstop the mixed solvent A with a magnetic sitter till supernate is black, pouring the supernate after standing, performing washing with deionized water, and performing drying to obtain pretreated copper powder; mixing glucose / saccharose and the pretreated copper powder to obtain mixed solvent B, and treating the mixed solvent B to obtain carbon-clad copper powder; mixing terpilenol, ethyl cellulose, ethyl acetate, polyether defoamer, silane coupling agent and sorbitan trioleate into mixed solution, and heating the mixed solution to obtain organic carrier; mixing glass powder, the carbon-clad copper powder and the organic carrier into the carbon-clad copper electronic paste. The preparation method has the advantages that production cost is effectively lowered since no special equipment for production is required, and the prepared carbon-clad copper electronic paste has excellent conductivity and has long shelf life.

Description

technical field [0001] The invention belongs to the technical field of preparation methods of electronic packaging materials, and in particular relates to a preparation method of carbon-coated copper electronic paste. Background technique [0002] In recent years, with the rapid development of electronic industry integration and digitalization, electronic paste has been widely used in modern technical fields such as aviation, aerospace and electronic components. People not only require the electronic paste to be particularly small in resistance, but also have particularly high requirements on the stability of the electronic paste. [0003] Generally, electronic pastes can be divided into noble metal conductive pastes and base metal conductive pastes according to different conductive phases. [0004] At present, among the precious metal electronic pastes, silver paste is widely used, and its electrical and thermal conductivity is stable, but its expensive price limits its sc...

AI Technical Summary

Problems solved by technology

[0004] At present, among the precious metal electronic pastes, silver paste is widely used, and its electrical and thermal conductivity is stable, but the expensive price limits its application scope, and Ag + It has migration phenomenon, which will reduce the conductivity of the conductive paste, thereby affecting the life of electronic components

[0005] The cost of base metal conductive paste is relatively low. In China, copper, nickel, and aluminum are mainly used to replace precious metals. Among them, copper paste is widely used. This is because the price of copper powder is relatively low, and the source is wide. Frequency characteristics and conductivity, the conductivity is second only to silver, and its performance can meet the requirements of electronic paste; but due to the poor stability of copper, it is easy to be oxidized during use, so it needs to be modified to improve its performance. Stability and Oxidation Resistance