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A semiconductor adhesive film material for preparing lightning protection shunt strips and its preparation method

A technology of semiconductor and shunt strips, which is applied in the field of semiconductor film materials and its preparation, can solve problems such as complex processes, incompatibility, and mismatch, achieve good application prospects, improve dielectric properties, and solve the effects of stability

Inactive Publication Date: 2016-08-24
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the technical problems of complex process, incompatibility and mismatch caused by co-bonding or secondary bonding of other adhesives in the existing technology, and provides a kind of method for preparing lightning protection shunt Strip semiconductor adhesive film material and preparation method thereof

Method used

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  • A semiconductor adhesive film material for preparing lightning protection shunt strips and its preparation method

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specific Embodiment approach 1

[0021] Specific Embodiment 1: In this embodiment, a semiconductor film material used to prepare lightning protection shunt strips consists of 75 to 100 parts by weight of epoxy resin, 15 to 30 parts of thermoplastic resin, and 6 to 12 parts It consists of rubber elastic body, 15-25 parts of curing agent, 2-6 parts of accelerator, 6-12 parts of non-metallic conductive filler and 10-20 parts of non-metallic semiconductor filler.

specific Embodiment approach 2

[0022] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is: a semiconductor adhesive film material used to prepare lightning protection shunt strips, in terms of parts by weight, consists of 80-90 parts of epoxy resin, 20-25 parts It consists of 8-10 parts of thermoplastic resin, 8-10 parts of rubber elastic body, 18-22 parts of curing agent, 2.5-3 parts of accelerator, 7-10 parts of non-metallic conductive filler and 14-16 parts of non-metallic semiconductor filler. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0023] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the epoxy resin is composed of bisphenol A epoxy resin and tetrafunctional epoxy resin, and bisphenol A epoxy resin and tetrafunctional epoxy resin The mass ratio of functional epoxy resin is 4:1. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a semiconductor adhesive film material and a preparation method thereof, particularly a semiconductor adhesive film material for preparing lightning-protection shunt bars and a preparation method thereof. The invention aims to solve the technical problems of complex technique, incompatibility and nonmatching property caused by co-gluing or secondary gluing when other adhesives are adopted in the existing technique. The material is composed of the following components in parts by weight: 75-100 parts of epoxy resin, 15-30 parts of thermoplastic resin, 6-12 parts of rubber elastomer, 15-25 parts of curing agent, 2-6 parts of accelerator, 6-12 parts of non-metal conducting filler and 10-20 parts of non-metal semiconductor filler. The method comprises the following steps: 1. weighing; 2. preparing a resin mixture; 3. blending and discharging; and 4. calendering to form the film. The semiconductor adhesive film material has the characteristics of the structural adhesive film and also has the characteristic of resistance value of the semiconductor adhesive material. The semiconductor adhesive film material is used for preparing lightning-protection shunt bars.

Description

technical field [0001] The invention relates to a semiconductor adhesive film material and a preparation method thereof. Background technique [0002] The aircraft radome is generally located at the front of the aircraft. It is required that the radome not only ensures the smooth passage of radar electromagnetic waves, but also protects the radar antenna from the harmful effects of external loads (such as wind, rain, sand, dust, lightning, etc.). important part of the body. In order to ensure that electromagnetic waves pass through the radomes smoothly, most radomes are made of dielectric materials. Dielectric materials are poor conductors of electricity, and the aircraft radome is located on the most vulnerable position on the aircraft to be attacked by lightning, so the industry generally uses lightning shunt strips for protection. [0003] The radome lightning protection system is generally composed of conductive or semi-conductive materials, such as compounding metal f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L101/00C08L81/06C08L71/10C08L21/00C08L15/00C08L13/00C08K7/00C08K3/04C08K3/02
Inventor 王德志曲春艳冯浩杨海冬毛勇张杨宿凯李洪峰刘长威王海民
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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