A kind of epitaxial growth method that improves LED luminous efficiency
A technology of epitaxial growth and luminous efficiency, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low hole migration ability, lack of quantum wells, and inability to migrate, and achieve the effect of improving luminous efficiency
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Embodiment 1
[0029] Example one (invention)
[0030] 1. Put the cleaned sapphire substrate into the MOCVD equipment and bake it at 1100°C for 10 minutes.
[0031] 2. Grow a low-temperature GaN layer with a thickness of 10nm at a temperature of 620°C and a growth pressure of 500torr.
[0032] 3. The temperature is raised to 1165°C to grow an undoped u-GaN layer with a thickness of 1.5um, and the growth pressure is 200torr.
[0033] 4. The temperature is raised to 1170°C, and a layer of n-GaN doped with silane is grown with a thickness of 2.0um, and the growth pressure is 200torr.
[0034] 5. Switch the carrier gas, change from hydrogen to nitrogen, at a pressure of 200 torr, and grow AlxGa1-xN / InyGa1-yN multiple quantum well layers. The temperature is lowered to 1075°C to grow an InyGa1-yN quantum well layer with a thickness of 3nm; and the temperature is increased to 1165°C to grow an AlxGa1-xN quantum barrier layer with a thickness of 10nm to complete the growth of a pair of quantum wells. Then t...
Embodiment 2
[0038] Embodiment 2 (traditional scheme)
[0039] 1. Put the cleaned sapphire substrate into the MOCVD equipment and bake it at 1100°C for 10 minutes.
[0040] 2. Grow a low-temperature GaN layer with a thickness of 10nm at a temperature of 620°C and a growth pressure of 500torr.
[0041] 3. The temperature is raised to 1165°C to grow an undoped u-GaN layer with a thickness of 1.5um, and the growth pressure is 200torr.
[0042] 4. The temperature is raised to 1170°C, and a layer of n-GaN doped with silane is grown with a thickness of 2.0um, and the growth pressure is 200torr.
[0043] 5. Switch the carrier gas, change from hydrogen to nitrogen, at a pressure of 200 torr, and grow AlxGa1-xN / InyGa1-yN multiple quantum well layers. The temperature is lowered to 1075°C to grow an InyGa1-yN quantum well layer with a thickness of 3nm; and the temperature is increased to 1165°C to grow an AlxGa1-xN quantum barrier layer with a thickness of 10nm to complete the growth of a pair of quantum well...
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