Electroplating liquid for electroplating treatment

Abstract

The invention discloses an electroplating liquid for electroplating treatment. The electroplating liquid comprises the following compositions according to mass ratio: 9-10g / L of nickel sulfate, 0.6-0.8g / L of a hydrogen removal agent, 4-5g / L of citric acid, 4-6g / L of fluoroboric acid, 0.6-0.8g / L of lead acetate, 2-3g / L of glycol, 20-24g / L of stannous fluoborate, 6-8g / L of sulfuric acid, 5-6g / L of sodium hypophosphite and 4-6g / L of a brightening agent. After being electroplated by the electroplating liquid, the surface of a copper wire is good in corrosion resistance, excellent in conductivity, and antiwear; the nickel, lead and phosphorus elements are added, so that the diffusion of copper atoms towards the electroplating liquid can be effectively prevented; and the precipitation speed is fast, the current density range is wide, the electricity consumption is low, the electroplating quality is good, and the service life of the metal copper wire is prolonged.

Description

technical field [0001] The invention relates to an electroplating solution for electroplating treatment. Background technique [0002] In the current daily production and life process, metal copper wires are widely used. In order to improve corrosion resistance and electrical conductivity, most of the copper wires are plated with silver or tin. [0003] In the case of silver plating, although the silver layer has strong anti-corrosion performance, if it is exposed to the air for a long time, the surface of the silver-plated copper wire is easy to react with sulfides and halides in the air, causing overall discoloration of the surface, not only damage The appearance is changed, and the contact resistance is increased at the same time, and the brazing performance is deteriorated. It has been found through experiments that the essence of the discoloration of the silver-plated layer is surface ionization. If the plating layer is not pure enough and contains trace impurities suc...

AI Technical Summary

Problems solved by technology

During the electroplating process of this technical solution, copper atoms diffuse into the tin solution, which not only causes waste, but also reduces the corrosion resistance and conductivity of the overall structure after electroplating.