High-density package substrate on-hole disk product and preparation method thereof

Abstract

The invention discloses a high-density package substrate on-hole disk product and a preparation method of the high-density package substrate on-hole disk product. The preparation method comprises the following steps of drying a substrate, manufacturing locating holes, conducting laser drilling, conducting micro-etching, conducting copper plating, conducting pattern transfer, conducting electroplating for hole filling and conducting film stripping and etching, and then the high-density package substrate on-hole disk product is obtained. According to the method, under the effect of protective film layers of the thin copper substrate, the problem that copper foil at the bottom is cut through in the thin copper processing process in the past is solved, and a complete half-through hole structure is made on the thin copper substrate; meanwhile, the direct laser processing technology is adopted, the thickness of the copper foil can not be influenced, and through good matching between the direct laser processing technology and the MSAP process, a high-density Flip-chip product with the high-flatness on-hole disk structure can be manufactured.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a plate-on-hole product of a high-density packaging substrate and a preparation method thereof. Background technique [0002] As a carrier of semiconductor chips, one of the main functions of the packaging substrate is the transition structure between the chip and the circuit board. In order to meet the requirements of higher density packaging, packaging products with ultra-thin Flip-chip structure have aroused widespread interest in the industry and have developed rapidly in recent years. Compared with the traditional Wire-bonding structure, the feature of the Flip-chip structure packaging substrate is that the connection points are changed from the peripheral distribution to the planar array distribution, and the connection method with the chip is also changed from the traditional gold / copper wire to the small size solder ball. This technology of array...

AI Technical Summary

Problems solved by technology

However, the copper foil at the bottom of the thin copper substrate used in the MSAP process is easily penetrated during the processing process, which makes it difficult to ensure flatness, and having through holes is more likely to cause poor plating and affect product reliability.

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