Circuit board and method of making the same

A technology for circuit boards and aluminum substrates, applied in the field of circuit boards and their preparation, can solve problems such as poor heat dissipation of aluminum-based circuit boards, and achieve the effects of easy large-scale implementation, good heat dissipation, and high adhesion

Active Publication Date: 2018-06-26
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the technical problem of poor heat dissipation of existing aluminum-based circuit boards, and to provide an aluminum-based circuit board with good heat dissipation performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] (1) Pretreatment

[0067] After the aluminum substrate is cleaned, soak for 10 minutes in a degreasing solution with a temperature in the range of 50-60° C., and then put the degreased aluminum substrate in the polishing solution for 15 minutes of polishing. Among them, the composition of the solution used during degreasing is: NaOH 10g / L, NaOH 3 PO 4 30g / L, Na 2 CO 3 15g / L, sodium dodecylsulfonate 6g / L, with water as solvent. The composition of the polishing liquid used for polishing is: H 2 SO 4 20% by weight, HNO 3 10% by weight, H 3 PO 4 70% by weight, using water as a solvent.

[0068] (2) Anodizing

[0069]Use the aluminum substrate obtained in step (1) as the anode and immerse it in the electrolyte solution at a temperature of 40°C, and at the same time use stainless steel as the cathode, connect the cathode and anode to the positive and negative electrodes of the power supply respectively, and then apply a voltage of 18V to carry out electrolysis ...

Embodiment 2

[0091] The circuit board was prepared by the same method as in Example 1, the difference was that step (3) was carried out by the following method:

[0092] Soak the aluminum substrate obtained in step (2) in lanthanum chloride aqueous solution at 96° C. for 30 minutes. Wherein, in the solution, the concentration of lanthanum chloride is 0.05 mol / L, and the pH value of the solution is in the range of 5-5.5.

[0093] After testing, the content of lanthanum element in the aluminum oxide layer is 0.11% by weight.

[0094] After calculation, the plating speed is 2.0 μm / h. After testing, the adhesion of the plating layer formed by the electroless plating is ISO grade 0, the thermal conductivity of the obtained circuit board is 17W / (m·K), and the breakdown voltage is 2.3kV.

Embodiment 3

[0096] Using the same method as in Example 1 to prepare a circuit board, the difference is that step (4) is carried out using the following method:

[0097] Irradiating at least part of the surface of the aluminum oxide layer on the surface of the aluminum substrate obtained in step (3) with a laser to form a circuit pattern. Among them, the conditions of laser irradiation include: using a fiber laser, the laser wavelength is 1064nm, the power is 25W, the frequency is 50kHz, the line speed is 100mm / s, and the filling pitch is 0.05mm.

[0098] After calculation, the plating speed is 2.5 μm / h. After testing, the adhesion of the plating layer formed by electroless plating is ISO grade 0, the thermal conductivity of the obtained circuit board is 16W / (m·K), and the breakdown voltage is 2.3kV.

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Abstract

Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Description

technical field [0001] The invention relates to a circuit board and a preparation method thereof. Background technique [0002] With the development and progress of electronic technology, it has become an inevitable trend for electronic products to be light, thin, small, personalized, high-reliable and multi-functional, and aluminum-based circuit boards have emerged as the times require. [0003] At present, aluminum-based circuit boards generally form an organic layer on the surface of aluminum or aluminum alloy first, and then combine the copper foil and the organic layer by hot pressing to form a sandwich structure, and then apply film, exposure, and development to the copper foil. Etching to form the desired lines. In the aluminum-based circuit board prepared by such a method, the circuit layer and the aluminum substrate are connected through an organic layer, but the thermal conductivity of the organic layer is usually lower than 4W / (m K), which affects the ability of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/05H05K3/18C23C28/00C25D11/18
CPCH05K1/053C23C18/1608C23C18/1612C23C18/1868C23C18/1879C23C18/40C25D11/08C25D11/10C25D11/16C25D11/246H05K3/185H05K3/44H05K2201/0116H05K2203/0315H05K2203/107H05K2203/1147
Inventor 徐强林信平
Owner BYD CO LTD
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