Preparation method of thermosensitive polyurethane embedding adhesive

A technology of polyurethane and potting glue, applied in the field of polyurethane, which can solve the problems of shortening the high temperature withstand time, not meeting the needs of rapid industrial production, low activity, etc., and achieve the effects of excellent fluidity, low production energy consumption, and long operating time

Active Publication Date: 2014-11-26
ANHUI ANDA HUATAI NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is difficult for many polyurethane potting adhesives to take into account the problems of low viscosity, long operating time and fast curing. It is difficult to apply to the potting of complex electronic components, and it cannot meet the needs of rapid industrial production. Therefore, a low viscosity, normal temperature It has low activity to ensure excellent fluidity and long open time at room temperature. The curing speed is adjusted by temperature. When heated to the specified temperature, it will cure rapidly, shortening the high temperature withstand time of components, avoiding thermal damage of components, and operating time Polyurethane potting compound with long and fast curing speed is imminent and has high application value

Method used

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  • Preparation method of thermosensitive polyurethane embedding adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The specific preparation operation steps of a heat-sensitive polyurethane potting glue are as follows:

[0035] 1) Preparation of polyol components:

[0036] Add 34 grams of polyethylene glycol (Mn=1000) and 465 grams of polypropylene oxide diol 220 (Mn=2000) into a three-necked flask equipped with a thermometer and a stirring device, and dehydrate under vacuum at 110°C for 2 hours; cool down When the temperature is below 50°C, add 1 gram of dibutyltin dilaurate, 0.5 gram of 1,2-dimethylimidazole, 0.8 gram of bis(dimethylaminoethyl) ether derivative (BL-17), and stir evenly. After vacuum defoaming at room temperature, nitrogen gas is passed through for packaging to obtain the polyol component;

[0037] 2) Preparation of polyisocyanate components:

[0038] Add 100 grams of liquefied MDI and 96 grams of tris(chloroisopropyl) phosphate (TCPP) into a three-necked flask equipped with a thermometer and a stirring device, stir evenly, vacuum defoam at room temperature for 1...

Embodiment 2

[0043] Add 161 grams of polyethylene glycol (Mn=1000), 52 grams of polypropylene oxide triol 303 (Mn=300) and 80 grams of polypropylene oxide triol 330 into a three-necked flask equipped with a thermometer and a stirring device (Mn=3000), vacuum dehydration at 110°C for 2 hours; cool down to below 50°C, add 1g of dibutyltin dilaurate, 0.5g of 1,2-dimethylimidazole, 0.8g of BL-17, stir Uniform, vacuum defoaming at room temperature, followed by nitrogen gas for packaging, to obtain polyol components;

[0044] Add 100 grams of liquefied MDI and 150 grams of TCPP into a three-necked flask equipped with a thermometer and a stirring device and stir evenly, vacuum defoaming at room temperature for 10 minutes, and pack with nitrogen gas to obtain the polyisocyanate component;

[0045] Mix the polyol component and the polyisocyanate component uniformly at a mass ratio of 100:50, place them in an airtight container, and defoam at 35°C for 15 minutes to obtain a heat-sensitive polyuretha...

Embodiment 3

[0048] Add 30 grams of polytetrahydrofuran ether diol (Mn=2000), 40 grams of polypropylene oxide triol 303 (Mn=300), and 54 grams of polypropylene oxide ternary alcohol into a three-necked flask equipped with a thermometer and a stirring device. Alcohol 330 (Mn=3000) and 160 grams of castor oil, vacuum dehydration at 120°C for 2 hours; cool down to below 50°C, add 1 gram of dibutyltin dilaurate, 1 gram of N,N',N"-three Methylaminoethylpiperazine, 1 gram of BL-17, stirred evenly, vacuum degassed at room temperature and then packed with nitrogen gas to obtain the polyol component;

[0049] Add 110 g of H to a three-necked flask equipped with a thermometer and a stirring device 12 Stir MDI and 90 grams of TCPP evenly, vacuum defoam at room temperature for 10 minutes, and pack with nitrogen gas to obtain the polyisocyanate component;

[0050] Mix the polyol component and the polyisocyanate component uniformly at a mass ratio of 100:50, place them in an airtight container, and def...

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Abstract

The invention relates to a preparation method of a thermosensitive polyurethane embedding adhesive. The preparation method comprises the following preparation steps: 1, uniformly mixing polyether polyol, a thermosensitive catalyst and a thermosensitive auxiliary agent to obtain a polyol component; 2, uniformly mixing a fire retardant and polyisocyanate to obtain a polyisocyanate component; and 3, uniformly mixing the polyol component and the polyisocyanate component according to the mass ratio of 100:50-100 so as to obtain the thermosensitive polyurethane embedding adhesive. The thermosensitive polyurethane embedding adhesive is not solidified at normal temperature within 80 minutes. Within 40-90 DEG C, solidification speed is accelerated rapidly with the rising of the temperature. At 90 DEG C, the fastest solidification time is 1 minute 30 seconds. Main properties of the embedding adhesive are as follows: hardness: Shore A hardness 30-100; tensile strength (MPa): 0.4-1.0; volume resistivity (omega.M): being greater than 1*1013; fire resistance UL94; and vertical burning: V0.

Description

technical field [0001] The invention relates to the technical field of polyurethane, in particular to a method for preparing and using a heat-sensitive polyurethane potting glue. Background technique [0002] In recent years, potting adhesives have been widely used in electronic circuits, LEDs, capacitor potting, etc., and the usage is increasing year by year. At present, there are mainly three types of potting materials: epoxy resin, silicone and polyurethane: among them, epoxy resin potting glue is cheap, has excellent bonding performance, and good electrical insulation, but has poor low temperature flexibility, poor weather resistance, and large shrinkage rate. ;Silicone-based potting adhesives have good flame retardancy and excellent high and low temperature resistance, but are expensive and poor in electrical insulation; polyurethane-based potting adhesives combine the advantages of epoxy resin and silicone-based potting adhesives, and are soft and hard The degree and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J11/06C08G18/48C08G18/20C08G18/08
Inventor 许戈文熊潜生戴震何纪慧
Owner ANHUI ANDA HUATAI NEW MATERIALS CO LTD
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