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Laser processing device and method thereof

A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as difficult elimination of melt and difficult control of taper, and achieve shortening continuous time, increasing smoothness, reducing The effect of action time

Active Publication Date: 2014-11-26
北京中科镭特电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Compared with micro-hole drilling by impact drilling technology, the rotary cutting drilling technology can obtain better hole shape, but the taper of the general rotary cutting drilling technology is difficult to control, and the melt on the edge of the hole is difficult to eliminate

Method used

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  • Laser processing device and method thereof
  • Laser processing device and method thereof
  • Laser processing device and method thereof

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Embodiment Construction

[0078] The present invention is described in detail below in conjunction with accompanying drawing:

[0079] figure 1 A schematic diagram showing a laser processing apparatus according to one embodiment of the present invention. The laser processing device is composed as follows: laser 1, which is used to emit continuous or pulsed laser with high energy; electronic shutter 2, which uses its delay to block the initial unstable part of the pulsed laser to avoid irregularities in the processing surface; installed on the electric The lens group on the translation stage is composed of lens 31 and lens 32. The distance between lens 31 and lens 32 is relatively adjustable to reduce the divergence angle of the emitted laser beam and expand the spot diameter; Dove prism 4 is installed on the hollow shaft In the rotating motor, it can rotate at a high speed. When the Dove prism rotates at a speed ω, the outgoing light beam rotates at a speed of 2ω; the flat reflector 5 guides the light...

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Abstract

The invention provides a laser processing device and a method of the laser processing device. The laser processing device comprises a laser, a lens set, a Dove prism, a plane mirror, a focus lens and a workpiece to be processed which are all sequentially arranged in the direction of an optical axis, wherein the lens set is composed of two lenses, and the distance between the two lenses can be adjusted so that the spot sizes and the divergence angles of outgoing beams of the laser can be adjusted; the Dove lens is installed in a rotary motor and rotates with the optical axis as the center, and the beams going out from the Dove lens also rotate with the optical axis as the center; the plane mirror is used for deflecting the transmission direction of the beams; the position of the focus lens in the beam transmission direction can be adjusted, and the beams are focused on the surface of the workpiece to be processed after passing through the focus lens; the workpiece to be processed is placed on an electric displacement platform and can make two-dimensional movement in the plane perpendicular to the transmission direction of the beams.

Description

technical field [0001] The invention belongs to the technical field of laser processing, relates to a laser processing device and a method thereof, and is particularly suitable for laser microprocessing of high hardness and high brittle materials. Background technique [0002] Laser processing technology has the advantages of high precision, strong versatility, high efficiency, low cost and significant comprehensive technical and economic benefits. It has become one of the key technologies in the modern manufacturing field and has solved some problems that cannot be solved by traditional mechanical processing. Laser processing has high efficiency, no tool loss, and can process hard, brittle, soft and other difficult-to-process materials. It is an advanced processing method for micro-processing technology. [0003] Micromachining is a major branch of the field of laser processing. With the advancement of science and technology and the improvement of manufacturing technology, ...

Claims

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Application Information

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IPC IPC(8): B23K26/064B23K26/02
CPCB23K26/0643B23K26/0648B23K26/0652
Inventor 李俊李纪东杨顺凯
Owner 北京中科镭特电子有限公司
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