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No-clean soldering flux for copper wire processing

A no-clean, flux-free technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., it can solve the problems of excessive residue, high corrosion, poor appearance, etc., to achieve less residue after welding, insulation High resistance, no need to clean

Inactive Publication Date: 2014-10-08
NINGGUO XINBONENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional rosin-based flux can satisfy this series of properties well, but there are many residues after soldering, high corrosion, and poor appearance. The printed board must be cleaned with freon or chlorinated hydrocarbons

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A no-cleaning flux for copper wire processing, characterized in that: it comprises the following mass percentage components: isopropanol 60g / l, ethylene glycol 60g / l, oxidized polyethylene wax 2g / l, glutaric acid 2g / l, tetraethylene glycol dimethyl ether 2g / l, hydrogenated rosin 60g / l, ethyl palmitate 30g / l, benzotriazole 2g / l, lauryl polyoxyethylene ether 2g / l, calcium chloride 2-6g / l, methanol 60g / l, ethylenediamine 2g / l, the balance is water.

[0013] The beneficial effects of the present invention are: the present invention does not contain halogen, has good solderability, low solid content, less residue after welding, no need for cleaning, high insulation resistance, uses deionized water as solvent, and can completely avoid VOCs substances, It is an environmentally friendly flux and will not burn at all. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of environmental ...

Embodiment 2

[0015] A no-cleaning flux for copper wire processing, characterized in that: it comprises the following mass percentage components: isopropyl alcohol 120g / l, ethylene glycol 120g / l, oxidized polyethylene wax 6g / l, glutaric acid 6g / l, tetraethylene glycol dimethyl ether 6g / l, hydrogenated rosin 120g / l, ethyl palmitate 60g / l, benzotriazole 6g / l, lauryl polyoxyethylene ether 6g / l, calcium chloride 6g / l, methanol 120g / l, ethylenediamine 6g / l, the balance is water.

[0016] The beneficial effects of the present invention are: the present invention does not contain halogen, has good solderability, low solid content, less residue after welding, no need for cleaning, high insulation resistance, uses deionized water as solvent, and can completely avoid VOCs substances, It is an environmentally friendly flux and will not burn at all. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of enviro...

Embodiment 3

[0018] A no-cleaning flux for copper wire processing, characterized in that: comprising the following mass percentage components: isopropyl alcohol 90g / l, ethylene glycol 90g / l, oxidized polyethylene wax 4g / l, glutaric acid 4g / l, tetraethylene glycol dimethyl ether 4g / l, hydrogenated rosin 90g / l, ethyl palmitate 45g / l, benzotriazole 4g / l, lauryl polyoxyethylene ether 4g / l, calcium chloride 4g / l, methanol 90g / l, ethylenediamine 4g / l, the balance is water.

[0019] The beneficial effects of the present invention are: the present invention does not contain halogen, has good solderability, low solid content, less residue after welding, no need for cleaning, high insulation resistance, uses deionized water as solvent, and can completely avoid VOCs substances, It is an environmentally friendly flux and will not burn at all. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of environmenta...

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PUM

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Abstract

The invention discloses a no-clean soldering flux for copper wire processing, which is characterized by comprising the following components in percentage by weight: 60-120 g / l of isopropanol, 60-120 g / l of ethylene glycol, 2-6 g / l of oxidized polyethlene wax, 2-6 g / l of glutaric acid, 2-6 g / l of tetraethylene glycol dimethyl ether, 60-120 g / l of hydrogenated rosin, 30-60 g / l of ethyl palmitate, 2-6 g / l of benzotriazole, 2-6 g / l of lauryl alcohol-polyoxyethylene ether, 2-6 g / l of calcium chloride, 60-120 g / l of methanol, 2-6 g / l of ethanediamine and the balance of water. The no-clean soldering flux has the benefits of no halogen contained, good weldability, low solid content, less residue after welding, no cleaning needed and high insulation resistance; as deionized water is used as a solvent, VOCs (Volatile Organic Compounds) can be completely prevented; the no-clean soldering flux is an environmentally-friendly soldering flux and cannot be burned at all; the no-clean soldering flux has excellent performance and can overcome the defect of an existing no-clean soldering flux, and well meet the environment-friendly requirement requirements during the use.

Description

technical field [0001] The invention relates to the field of metal welding, in particular to a no-clean flux used for copper wire processing. Background technique [0002] As we all know, the flux used in the electronics industry must not only provide excellent fluxing performance, but also not corrode the materials to be welded, and at the same time meet a series of mechanical and electrical performance requirements. With the rapid development of the electronics industry and fierce competition in the market, solder manufacturers hope to produce products with excellent soldering performance and low price. As an auxiliary material of solder paste (mass fraction is 10%-20%), flux can not only provide excellent soldering performance, but also directly affect the printing performance and storage life of solder paste. Therefore, the quality of flux directly affects the entire process and product quality of Surface Mount Technology (SMT for short). [0003] The quality of flux d...

Claims

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Application Information

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IPC IPC(8): B23K35/362
CPCB23K35/362B23K35/3612B23K2101/32B23K2101/36
Inventor 罗宏强
Owner NINGGUO XINBONENG ELECTRONICS
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