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Preparation method of copper-graphene complex phase

A technology of graphene and graphene nanosheets, applied in electrolytic coatings, coatings, etc., can solve the problems of poor process controllability, high oxygen content of copper-graphene composite phase, low composite phase resistivity, etc., and achieve mechanical properties And good corrosion resistance, wide application range, avoid the effect of reduction process

Inactive Publication Date: 2014-09-24
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the reduction effect of GO is limited by the copper matrix, the oxygen content in the copper-graphene composite phase obtained by this method is high, resulting in a composite phase with lower resistivity than copper foil
In addition, the reduction process of GO involves complex processes such as high temperature, and the reduction process will have a certain impact on the formation of the final copper-graphene composite phase, resulting in poor controllability of the process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 1) Substrate treatment: Use hydrochloric acid with a molar concentration of 5% to remove oxides on the surface of the copper plate, and then rinse with deionized water;

[0018] 2) Copper plating solution configuration: Dissolve copper sulfate in water, add sulfuric acid, sodium dodecylbenzenesulfonate and hydrochloric acid in sequence, and stir evenly to obtain a copper plating solution; the copper sulfate in the copper plating solution is 200g / L, The sulfuric acid is 80 g / L, the chloride ion is 80 ppm, and the sodium dodecylbenzenesulfonate is 0.1 g / L;

[0019] 3) Electroplating solution configuration: Wet the single-layer graphene nanosheets with a small amount of the copper plating solution prepared in step 2) and ultrasonically, and then add it to the remaining copper plating solution. The concentration of graphene nanosheets is 0.01g / L , fully stirred to obtain a graphene-containing electroplating solution;

[0020] 4) Electroplating: Use the phosphor copper shee...

Embodiment 2

[0022] 1) Substrate treatment: Use hydrochloric acid with a molar concentration of 30% to remove oxides on the surface of the aluminum plate, and then rinse with deionized water;

[0023] 2) Copper plating solution configuration: Dissolve copper sulfate in water, add sulfuric acid, sodium dodecylbenzenesulfonate and hydrochloric acid in sequence, and stir evenly to obtain a copper plating solution; the copper sulfate in the copper plating solution is 150g / L, Sulfuric acid is 90 g / L, chloride ion is 50 ppm, sodium dodecylbenzenesulfonate is 2g / L;

[0024] 3) Electroplating solution configuration: first wet the multilayer graphene nanosheets with a small amount of the copper plating solution configured in step 2) and ultrasonically, and then add it to the remaining copper plating solution. The concentration of the graphene nanosheets is 4g / L. Stir fully to obtain a graphene-containing electroplating solution;

[0025] 4) Electroplating: Use the phosphor copper sheet as the anod...

Embodiment 3

[0027] 1) Substrate treatment: Use hydrochloric acid with a molar concentration of 20% to remove oxides on the surface of the copper tube, and then rinse with deionized water;

[0028] 2) Copper plating solution configuration: Dissolve copper sulfate in water, add sulfuric acid, sodium dodecylbenzenesulfonate and hydrochloric acid in sequence, and stir evenly to obtain a copper plating solution; the copper sulfate in the copper plating solution is 150g / L, The sulfuric acid is 40 g / L, the chloride ion is 50 ppm, and the sodium dodecylbenzenesulfonate is 1 g / L;

[0029] 3) Electroplating solution configuration: Wet the single-layer graphene nanosheets with a small amount of the copper plating solution prepared in step 2) and ultrasonically, and then add it to the remaining copper plating solution. The concentration of graphene nanosheets is 0.1g / L , fully stirred to obtain a graphene-containing electroplating solution;

[0030] 4) Electroplating: use the phosphor copper sheet a...

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PUM

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Abstract

The invention discloses a preparation method of a copper-graphene complex phase. The preparation method comprises the following steps of: (1) removing oxides from the surface of a base plate by using hydrochloric acid; (2) preparing copper sulfate, sulfuric acid, the hydrochloric acid and a surfactant into a copper plating solution; (3) adding a graphene nanosheet to the copper plating solution to obtain a plating solution which contains the graphene nanosheet; and (4) placing a phosphorus copper sheet serving as an anode and the base plate serving as a cathode into the plating solution for plating to obtain the copper-graphene complex phase. The preparation method disclosed by the invention prevents the GO reduction process of the traditional method by directly compounding graphene and copper and therefore has the advantages of simple process, good controllability and wide application range; the prepared copper-graphene complex phase has good electrical property, antioxidation property, mechanical property and anti-corrosive property.

Description

technical field [0001] The invention relates to a preparation method of copper-graphene composite phase. Background technique [0002] Graphene has extremely high carrier mobility, thermal conductivity, and oxidation resistance. Combining graphene with copper can not only improve the electrical and thermal conductivity of copper, but also improve the oxidation resistance of copper. [0003] The existing copper-graphene composite phase is to combine graphene oxide (GO) with copper, and then reduce GO to graphene to obtain copper-graphene composite phase. However, since the reduction effect of GO is restricted by the copper matrix, the oxygen content in the copper-graphene composite phase obtained by this method is high, resulting in a lower resistivity of the composite phase than that of copper foil. In addition, the reduction process of GO involves complex processes such as high temperature, and the reduction process will have a certain impact on the formation of the final ...

Claims

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Application Information

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IPC IPC(8): C25D15/00
Inventor 徐杨任招娣骆季奎俞滨
Owner ZHEJIANG UNIV
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