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Heat-conduction epoxy resin composite material and preparation method thereof

A technology of epoxy resin and composite materials, which is applied in the field of polymer composite materials, can solve the problems of complex preparation, high cost of hyperbranched polymers, and decreased thermal conductivity of composite materials, achieving good stability, less addition, and guaranteed thermal conductivity performance effect

Active Publication Date: 2014-07-30
东莞市福佑电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] For example, the Chinese patent with the application number CN200910273307.8 discloses "an electrical insulating and thermally conductive epoxy resin composite material and its preparation method", which uses a hyperbranched polymer with strong electrical insulating and thermal conductivity to coat carbon nanotubes , to prepare carbon nanotube-epoxy resin composite materials, but the cost of hyperbranched polymers covering carbon nanotubes is relatively high, and the preparation is relatively complicated; the Chinese patent application number CN201310363280.8 discloses "epoxy resin / nano Copper / carbon nanotube thermal interface composite material and its preparation method”, in which carboxylated carbon nanotubes and nano-copper particles are co-dissolved and compounded into epoxy resin to improve the thermal conductivity of epoxy resin-based composite materials, However, copper is easy to oxidize, which will lead to a decrease in the thermal conductivity of the composite material

Method used

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  • Heat-conduction epoxy resin composite material and preparation method thereof

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Comparison scheme
Effect test

Embodiment 1

[0030] A heat-conducting epoxy resin composite material, according to the parts by mass, the preparation method is as follows:

[0031] 1 Put 0.6 parts of carbon nanotubes into concentrated H 2 SO 4 and HNO 3 The mixed solution (volume ratio: 3:1) was treated for 3 hours under the action of ultrasonic vibration and mechanical stirring, and then washed with a large amount of deionized water until neutral.

[0032] 2 Add the obtained carbon nanotubes into thionyl chloride, heat to 60° C. under ultrasonic vibration, reflux for 24 hours, and then distill off excess thionyl chloride under reduced pressure.

[0033] 3. Add the obtained carbon nanotubes to 40 parts of triethylenetetramine, stir and react with magnetic force at 120°C for 96 hours, filter, wash off excess triethylenetetramine with absolute ethanol, and dry under vacuum at 70°C to obtain aminated carbon nanotubes Tube.

[0034] 4 Add 2.0 parts of nano-aluminum nitride to absolute ethanol and heat it to 65°C with ult...

Embodiment 2

[0037] A heat-conducting epoxy resin composite material, according to the parts by mass, the preparation method is as follows:

[0038] 1 Put 2.0 parts of carbon nanotubes into concentrated H 2 SO 4 and HNO 3 The mixed solution (volume ratio: 3:1) was treated with ultrasonic vibration and mechanical stirring for 5 hours, and then washed with a large amount of deionized water until neutral.

[0039] 2 Add the obtained carbon nanotubes into thionyl chloride, heat to 65°C under ultrasonic vibration, and reflux for 18 hours, and then distill off excess thionyl chloride under reduced pressure.

[0040] 3. Add the obtained carbon nanotubes to 35 parts of triethylenetetramine, stir and react with magnetic force at 120°C for 96 hours, filter, wash off excess triethylenetetramine with absolute ethanol, and dry under vacuum at 70°C to obtain aminated carbon nanotubes Tube.

[0041] 4 Add 5.0 parts of nano-aluminum nitride to absolute ethanol and heat it to 65°C with ultrasonic vibra...

Embodiment 3

[0044] A heat-conducting epoxy resin composite material, according to the parts by mass, the preparation method is as follows:

[0045] 1 Put 1.5 parts of carbon nanotubes into concentrated H 2 SO 4 and HNO 3 The mixed solution (volume ratio is 3:1), under the action of ultrasonic vibration and mechanical stirring, treated for 4h, and then washed with a large amount of deionized water until neutral.

[0046] 2 Add the obtained carbon nanotubes into oxalyl chloride, heat to 70°C under ultrasonic vibration, reflux for 20 hours, and then distill off excess oxalyl chloride under reduced pressure.

[0047] 3 The obtained carbon nanotubes were added to 50 parts of ethylenediamine, stirred with magnetic force at 120°C for 96 hours, filtered, washed with absolute ethanol to remove excess ethylenediamine, and vacuum-dried at 70°C to obtain aminated carbon nanotubes.

[0048] 4 Add 6.0 parts of nano-aluminum nitride to absolute ethanol and heat it to 65°C with ultrasonic vibration, add...

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Abstract

The invention relates to the field of high-molecular composite materials, and concretely relates to a heat-conduction epoxy resin composite material and a preparation method thereof. The heat-conduction epoxy resin composite material comprises the following compositions in parts by mass: 0.5-3.0 parts of carbon nanotubes, 0.5-10.0 parts of nanometer aluminium nitride, 0.1-1.0 part of a silane coupling agent, 0.1-0.5 part of stearic acid, 60-80 parts of epoxy resin and 8-30 parts of a curing agent. According to the preparation method, amino-functionalized carbon nanotubes and nanometer aluminium nitride subjected to surface modification by employing a coupling agent are dispersed in epoxy resin, so that the epoxy resin material with heat-conduction function is prepared, the operation technology is simple, on the one hand, the heat conduction performance of the material is guaranteed, and on the other hand, the cost is reduced. The addition amount of functional materials employed by the composite material is less, the stability of the product is good, and the composite material is applicable to electric appliances, electron heat radiation and other aspects.

Description

technical field [0001] The invention relates to the field of polymer composite materials, in particular to a heat-conducting epoxy resin composite material and a preparation method thereof. Background technique [0002] Epoxy resin is an important class of thermosetting resins, widely used in adhesives, coatings and other purposes. Common epoxy resins are bisphenol A glycidyl ether resins, containing hydroxyl and epoxy groups, with a thermal conductivity of 0.31~0.36 W.m -1 .K -1 , is one of the most widely used epoxy resins. Although epoxy resin has a high cross-linked structure and excellent process performance, it has the disadvantages of brittleness and poor impact resistance, and is a poor conductor of heat, which limits its use in some occasions that require heat dissipation of electronic devices. [0003] Aluminum nitride has high thermal conductivity (about 320 W.m -1 .K -1 ), which is more than 5 times that of alumina, and its thermal expansion coefficient is s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K13/06C08K9/04C08K9/02C08K7/00C08K3/04C08K9/06C08K3/28C08G59/42
Inventor 解芳梁浩封科军强娜
Owner 东莞市福佑电子科技有限公司
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