Modified phenol-formaldehyde resin adhesive and preparation method thereof

A technology of phenolic resin and adhesive, applied in the direction of adhesive, aldehyde/ketone condensation polymer adhesive, adhesive type, etc., can solve the problems of low peel strength, high temperature curing, high brittleness, etc., and achieve natural aging resistance Good results

Inactive Publication Date: 2014-07-09
WUJIANG KAIYING TRADE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But it also has some disadvantages, such as high brittleness, low peel strength, high temperature curing, etc.

Method used

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Experimental program
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Embodiment 1

[0022] A modified phenolic resin adhesive, in parts by weight, consists of the following components:

[0023] Phenolic resin: 160, polyvinyl formal: 70,

[0024] Ethyl orthosilicate: 30, Propyl gallate: 5,

[0025] Hexamethylenetetramine: 4, Triethanolamine: 3,

[0026] Ethyl acetate: 400, absolute ethanol: 60.

[0027] The preparation method of described modified phenolic resin adhesive comprises the following technical steps:

[0028] (1) Dissolve polyvinyl formal and hexamethylenetetramine in ethyl acetate according to the proportion, and stir to completely dissolve the solid matter;

[0029] (2) Dissolve propyl gallate in absolute ethanol and disperse evenly;

[0030] (3) Add the product of step (2) to the product of step (1), and then add the remaining components one by one, stir and disperse evenly to obtain the finished product.

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PUM

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Abstract

The invention discloses a modified phenol-formaldehyde resin adhesive. The phenol-formaldehyde resin adhesive is composed of the following components by weight: 100-200 parts of a phenol-formaldehyde resin, 60-80 parts of polyvinylformal acetal, 20-40 parts of tetraethoxysilane, 3-6 parts of propyl gallate, 3-5 parts of hexamethylenetetramine, 2-4 parts of triethanolamine, 300-500 parts of ethyl acetate and 50-80 parts of anhydrous ethanol. Compared with a conventional phenol-formaldehyde resin adhesive, the modified phenol-formaldehyde resin adhesive provided by the invention has the following beneficial effects that (1) the phenol-formaldehyde resin contains a lot of hydroxymethyl and phenolic hydroxyl groups, so that the modified phenol-formaldehyde resin adhesive has large polarity, high bonding strength and good bonding property for metals and nonmetals; (2) the modified phenol-formaldehyde resin adhesive has relatively large rigidity and excellent heat-resistant property; and (3) the modified phenol-formaldehyde resin adhesive has relatively good high temperature ageing resistance and naturally ageing resistance in air.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and more specifically relates to a modified phenolic resin adhesive and a preparation method thereof. Background technique [0002] Phenolic resin is mainly formed by polycondensation and dehydration of phenol and aldehyde. It is one of the earliest synthetic resins used in the adhesive industry. Depending on the proportion of phenol and aldehyde used and the catalyst, it can be made into two types: thermosetting phenolic resin and thermoplastic phenolic resin. [0003] The adhesive made of phenolic resin as the main raw material has many advantages, such as good bonding performance, good heat resistance and oil resistance. But it also has some disadvantages, such as high brittleness, low peel strength, and high temperature curing. Contents of the invention [0004] The object of the present invention is to overcome the deficiencies in the prior art and provide a modified phenolic resin adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/06C09J129/14C09J11/06
Inventor 倪孔燕
Owner WUJIANG KAIYING TRADE
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