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Net point punching device for die core

A punching device and mesh point technology, applied in the punching field, can solve the problems of difficult adjustment of impact force, large variation of mesh aperture and depth tolerance, etc., and achieve the effects of improving punching accuracy, yield and controllability.

Inactive Publication Date: 2014-06-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is how to overcome the problem that the impact force of the existing mold core stamping equipment is not easy to adjust, which causes large changes in the tolerance of the aperture and depth of the mesh

Method used

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  • Net point punching device for die core
  • Net point punching device for die core
  • Net point punching device for die core

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Embodiment Construction

[0028] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] Such as figure 1 with image 3 As shown, a die core dot stamping device according to an embodiment of the present invention includes a stamping mechanism, a mounting base 9, a first driver, a first horizontal guide rail 8, a laser rangefinder 11, a displacement calculation controller, a host computer and working platform12. Wherein, the working platform 12 is positioned under the cutter head 2; the stamping mechanism and the laser range finder 11 are all fixed on the mounting support 9, and the mounting support 9 is installed on the first horizontal guide rail 8 and can move along the first horizontal guide rail. 8 do horizontal movement, the direction of movemen...

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PUM

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Abstract

The invention relates to the technical field of displaying and discloses a net point punching device for a die core. The net point punching device comprises a punching mechanism, a laser distance measuring instrument, a displacement calculation controller and an upper computer. The punching mechanism and the laser distance measuring instrument are installed on an installation support, the installation base is installed on a first horizontal guide rail and can horizontally move along the first horizontal guide rail. A first driver is installed on the first horizontal guide rail and connected with the installation base through a first transmission mechanism. The displacement calculation controller is respectively and electrically connected with the laser distance measuring instrument and the upper computer. The upper computer is electrically connected with the punching mechanism and the first driver. The laser distance measuring instrument is adopted for accurately measuring the depth and bore diameter of net points, the flatness of the die core surface and the distance between the net points in real time. In the punching process, net point punching force and the moving position of the punching mechanism can be adjusted in real time, so that the bore diameter, the depth and evenness are accurately controlled, and then the depth and bore diameter tolerance of the net points is reduced.

Description

technical field [0001] The invention relates to the technical field of punching, in particular to a die core dot punching device. Background technique [0002] Thin film transistor liquid crystal display (Thin film transistor liquid crystal display, TFT-LCD for short) technology has been quite mature for applications from small-sized mobile phone screens to large-sized TV screens. [0003] The backlight module of the LCD panel is composed of light source, reflector, light guide plate, diffusion plate, prism film and optical film. One of the main technologies of its products lies in the optical design of the light guide plate, mold design and manufacturing, precision injection molding technology. The most important thing for the light guide plate is the improvement and uniform distribution of the luminance value, so the performance of the light guide plate is directly related to the yield rate of the entire backlight module. [0004] At present, the mainstream technology of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D22/04B21C51/00
CPCB26D5/086B26D5/007B26D7/28B26F1/02B26F1/24Y10T83/02Y10T83/04Y10T83/178Y10T83/87
Inventor 曹春雷
Owner BOE TECH GRP CO LTD
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