Copper alloy wire used for semiconductor devices
A copper alloy and semiconductor technology, applied in the field of copper alloy wires with manganese and/or zinc elements, can solve the problems of material cost reduction, achieve improved physical and chemical properties, high heat softening degree, improved oxidation resistance and corrosion resistance Effect
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[0020] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced.
[0021] First, in an embodiment of the present invention, the present invention can provide a copper / manganese alloy wire, which is mainly used in the packaging and bonding process of semiconductor chips, to be electrically connected to an aluminum pad and a carrier of a semiconductor chip. Between the welding pads of the board, wherein the copper / manganese alloy wire of the present embodiment mainly comprises copper (Cu) base material, and the manganese (Mn) element of a specific weight ratio (wt%) is mixed, and above-mentioned specific weight ratio can be 20wt% to 40wt% manganese, with the balance being copper, for example comprising 22wt% to 38wt% manganese, 34wt% to 35wt% manganese, or 34.6wt% manganese. In the copper alloy wire of this embodiment, the manganese element is completely dissolved i...
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