Multi-layer ceramic laminar capacitor

A multilayer ceramic and capacitor technology, applied in the field of capacitors, can solve problems such as the difficulty of resisting high-voltage breakdown strength, and achieve the effects of avoiding electrode arcing, increasing effective distance, and reducing breakdown probability

Inactive Publication Date: 2014-05-21
CHENGDU RONGHUA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the current capacitors have small dimensions, it is very difficult to greatly improve their high-voltage breakdown strength without increasing the capacitor's dimensions.

Method used

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Embodiment Construction

[0016] As an embodiment of the present invention, such as figure 1 with figure 2 As shown, a multilayer ceramic chip capacitor includes a chip body, a first lead 1 and a second lead 2, and the chip body includes two external electrodes 3 respectively located at its two ends and two external electrodes 3 Between the first dielectric layer 4, the second dielectric layer 5 and the third dielectric layer 6; the first lead 1 and the second lead 2 are respectively arranged outside the external electrode 3, and the part connecting the external electrode 3 is provided with a lateral The extension section 10 makes the first lead 1 and the second lead 2 have an L shape, and the lateral extension section 10 is vertically connected to the middle of the external electrode 3 .

[0017] The first dielectric layer 4 is printed with two internal electrodes a7 distributed at intervals and in the shape of a small rectangle, and the two internal electrodes a7 are connected to the two external e...

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Abstract

The invention discloses a multi-layer ceramic laminar capacitor. The multi-layer ceramic laminar capacitor comprises a laminar main body, a first lead and a second lead, wherein the laminar main body comprises two outer electrodes, and a first medium layer, a second medium layer and a third medium layer which are positioned between the two outer electrodes; the first medium layer is provided with two inner electrodes a which are distributed at a certain interval and are in the forms of small rectangles, and the two inner electrodes a are connected with the two outer electrodes respectively; the second medium layer is provided with two inner electrodes b which correspond to the positions of the two inner electrodes a and are in the forms of large rectangles; the third medium layer is provided with two inner electrodes c which correspond to the positions of the inner electrodes a and the inner electrodes b and are in the forms of frame-type quadrangles; the third medium layer is positioned between the first medium layer and the second medium layer, and the three medium layers are overlapped in sequence; the first lead and the second lead are arranged outside the outer electrodes respectively, and transverse epitaxial segments are arranged on portions connected with the outer electrodes. By adopting the multi-layer ceramic laminar capacitor, the high-voltage puncture resistance can be improved greatly under the condition of not basically increasing the overall dimensions.

Description

technical field [0001] The invention relates to a capacitor, in particular to a multilayer ceramic chip capacitor. Background technique [0002] The medium and high voltage capacitors are multilayer ceramic chip capacitors, and the lead wire structure is such that the chip body is clamped at the center of the angle between the two lead wires. Two important technical indicators of medium and high voltage capacitors are the size of the capacitor and the breakdown strength of the capacitor. Due to the small thickness of the currently used medium and high voltage capacitors and the small angle between the two leads, the distance between the two leads and the electrode edge of the sheet body is too short, which easily causes tension between the leads and the electrodes. arc, resulting in breakdown of the capacitor voltage. [0003] Although the current capacitors have small dimensions, it is very difficult to substantially increase their high-voltage breakdown strength without ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/232H01G4/005
Inventor 李应忠
Owner CHENGDU RONGHUA ELECTRONICS
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