Multiple layered sheet structured ceramic capacitor for middle and high voltages

A ceramic capacitor and multi-layer chip technology, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems of unsatisfactory resistance to electrical breakdown and cannot meet the needs of electronic technology, and reduce breakdown Chance, improve the effect of high voltage breakdown strength

Inactive Publication Date: 2009-06-24
TSINGHUA TONGFANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the distortion of the fringe electric field between the electrodes in each layer, the disadvantage of this type of ceramic capacitor in application is that its resistance to electrical breakdown is not ideal enough to meet the rapid development of electronic technology.

Method used

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  • Multiple layered sheet structured ceramic capacitor for middle and high voltages
  • Multiple layered sheet structured ceramic capacitor for middle and high voltages
  • Multiple layered sheet structured ceramic capacitor for middle and high voltages

Examples

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Embodiment Construction

[0014] see image 3 and Figure 4 , The ceramic capacitor of the present invention includes a plurality of dielectric layers in the form of three types of internal electrodes and external electrodes at both ends, which are made of ceramic materials. The shape of the internal electrodes-2 of one type of dielectric layer 1 is two to N rectangles, arranged at intervals, and the outer edges of the internal electrodes-2 arranged on both sides are respectively connected to the external electrodes at both ends, and the second type of dielectric layer The shape of the internal electrodes 2 6 of 5 is two to two times N minus two framed quadrilaterals, and the shape of the internal electrodes 3 4 of the three types of dielectric layers 3 is a rectangle from one to N minus one, arranged at intervals. Where N is a natural number greater than two, the two ends of the internal electrodes on the three types of dielectric layers 3 are not connected to the external electrodes, and the above t...

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Abstract

A ceramic capacitor with a multilayer chip structure for medium and high voltages relates to the technical field of ceramic capacitors. The invention includes several dielectric layers in the form of three types of internal electrodes and two external electrodes made of ceramic materials. The shape of the internal electrodes 1 of one type of dielectric layer is two to N rectangles, arranged at intervals so that the outer edges of the internal electrodes 1 arranged on both sides are respectively connected to the external electrodes at both ends, and the internal electrodes of the second type of dielectric layer The shape of the second is two to two times N minus two circular quadrilaterals, and the shape of the inner electrode three of the three types of dielectric layers is a rectangle from one to N minus one, arranged at intervals. Wherein N is a natural number greater than two, and the above three types of numbers are stacked in sequence. Compared with the prior art, the invention can greatly reduce the breakdown probability caused by the fringe electric field distortion, and greatly improve the high-voltage breakdown resistance.

Description

technical field [0001] The invention relates to the technical field of ceramic capacitors, in particular to a ceramic capacitor with a multilayer chip structure suitable for medium and high voltages with a rated voltage above 250V direct current. Background technique [0002] In the technical field of making high-voltage capacitors, two important technical indicators must be considered, one is the size of the capacitor, and the other is the electrical breakdown strength of the capacitor. Although it is now possible to produce capacitors with very small dimensions, it is very difficult to improve their high-voltage breakdown strength without increasing the overall size. The structure of the ceramic capacitor with medium and high voltage multilayer chip structure commonly used in the prior art is made of ceramic materials, consisting of several dielectric layers in the form of two types of internal electrodes and external electrodes at both ends. The internal electrodes of on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30H01G4/005
Inventor 吉岸王晓慧陈仁政张力
Owner TSINGHUA TONGFANG CO LTD
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