Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of led bracket and led device thereof

A technology for LED brackets and LED devices, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor bonding force of conductive pins, reduced light output efficiency, LED failure, etc., to overcome poor bonding force, improve reliability, The effect of improving light extraction efficiency

Active Publication Date: 2017-01-18
APT ELECTRONICS
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At the same time, the above-mentioned whiteness-improved LCP plastic material still has a major problem that needs to be solved urgently, that is, the adhesion force between it and the copper sheet is particularly poor, which further affects its promotion in the field of LED technology.
Because the bonding force between this type of LCP plastic material and the conductive pins of the bracket is poor, the water vapor in the air can easily penetrate through the interface between this type of LCP plastic and the conductive pins, which will cause the LED to fail
[0010] Not only that, after careful research by the applicant, it was found that in order to improve the reliability of the LED, a Zener diode-like protective element is usually connected in parallel on the LED bracket, and these protective elements will absorb the light emitted by the LED, thereby reducing the light extraction efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of led bracket and led device thereof
  • A kind of led bracket and led device thereof
  • A kind of led bracket and led device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as figure 1 and 2 As shown, this embodiment discloses an LED bracket, including a first pad 102 and a second pad 103 connected together by an insulating bonding glue 101, and the first pad 102 and the second pad 103 are used with the LED chip The two electrodes are electrically connected to play the role of a support and conductive pin. The LED chip is powered by an external power supply through the first pad 102 and the second pad 103. The connection structure between the pad and the external power supply can be the edge of the pad Convex and other conventional structures.

[0045] Such as figure 1 and 2 As shown, the first bonding pad 102 and the second bonding pad 103 form a support bottom plate, and a reflective cup 104 is arranged around the support bottom plate to reflect the LED light emitted by the LED chip after being powered on and improve the light output efficiency of the LED. The shape of the reflective cup includes but is not limited to the shape ...

Embodiment 2

[0056] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that the shape of the concavo-convex part is different on the second edge 1022 of the first pad 102 and the fourth edge 1032 of the second pad 103, and the convex part is square Or a semicircular protruding part, and the concave part is the gap between the two protruding parts.

[0057] Compared with Example 1, the outward protruding square or quasi-semicircular convex portion of this example not only increases the bonding force between the reflective cup 104 and the metal pads (102, 103), but also increases the heat dissipation of the product area, so the bracket of this embodiment has better heat dissipation.

Embodiment 3

[0059] Such as Figure 5 As shown, the difference between this embodiment and Embodiment 1-2 is only that: a first injection hole 1023 to enhance the bonding force is provided in the area where the inside of the first pad 102 is combined with the bottom of the reflective cup 104, and in the first pad 102 A second injection hole 1033 that strengthens the bonding force is provided in the area where the inside of the second pad 103 is combined with the bottom of the reflector cup 104. The injection hole 1033 in the figure is a quasi-elliptical injection hole, which does not represent a limitation to the shape of the injection hole of the present invention. It is an injection hole of other shapes. The existence of the injection hole increases the bonding area between the metal pad and the plastic when the bracket is injected. At the same time, the existence of this structure makes the height difference between the bottom of the plastic reflection cup 104 and the bottom of the injec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED support and an LED device thereof. According to the LED support, concave-convex portions improving the binding force are arranged on the first edge of a first bonding pad and the third edge of a second bonding pad, and concave-convex portions improving the binding force are arranged on the second edge, combined with the bottom of a reflection cup, of the first bonding pad and the fourth edge, combined with the bottom of the reflection cup, of the second bonding pad; an electric protection area which stretches across an insulation joint colloid and is used for installing an electric protection component is arranged between the first bonding pad and the second bonding pad, the electric protection area and an area, used for installing an LED chip, in the reflection cup are isolated mutually, and the height of the electric protection area is larger than the height of the electric protection component and smaller than the height of the reflection cup; the insulation joint colloid, the reflection cup and the electric protection area are integrally formed by adopting high-temperature-resistant plastic. According to the LED support, the LCP high-temperature-resistant plastic low in cost can be adopted, the reliability is guaranteed, and the light-output efficiency is improved further.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to an LED bracket and an LED device thereof. Background technique [0002] As the application fields of LED become more and more extensive, the application side puts forward stricter requirements on the reliability of LED, especially after the ultraviolet LED light source is widely used, how to manufacture a high-reliability LED bracket and its packaging device becomes more challenging . [0003] At present, the most widely used LED brackets generally use nylon-based polymers (such as polyphthalamide (PPA) or polyamide (PA)-based polymers) as insulating reflectors. For LED bracket light sources that are injection molded with nylon-based polymers (PPA, PA9T, PA6T, PA), the heat generated by the LED chip when energized and turned on degrades the polymer resin, and the heat resistance of the LED bracket insulation reflection cavity decreases, gradually appearing. Yellowing a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/486H01L33/54H01L33/56H01L33/62
Inventor 何贵平姜志荣孙佳鑫万垂铭许朝军
Owner APT ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com