Manufacturing method for multi-layer ceramic capacitor

Abstract

The invention discloses a manufacturing method for a multi-layer ceramic capacitor. The manufacturing method includes the following steps that ceramic dielectric membranes are manufactured; inner electrodes and electric conduction blocks are formed by printing an electric conduction slurry on each ceramic dielectric membrane, the inner electrodes are arranged in the middle of the ceramic dielectric membrane, and the electric conduction blocks are arranged on the periphery of the ceramic dielectric membrane; the multiple ceramic dielectric membranes with the inner electrodes and the electric conduction blocks printed are stacked and laminated to obtain a stack-up body; the stack-up body is sintered at the protective gas atmosphere to obtain a ceramic chip; two outer electrodes are respectively arranged at the two ends of the ceramic chip to obtain the multi-layer ceramic capacitor. According to the manufacturing method for the multi-layer ceramic capacitor, the electric conduction blocks are arranged on the periphery of the ceramic dielectric membranes, in this way, the weight of the periphery of the ceramic dielectric membranes is increased, angle breaking can be prevented when the ceramic dielectric membranes are stacked, the machining qualified rate is improved, and in comparison with a traditional manufacturing method for the multi-layer ceramic capacitor, angle breaking is not prone to occurring.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for manufacturing a multilayer ceramic capacitor. Background technique [0002] Multilayer ceramic capacitors are laminated with ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and are sintered at high temperature at one time to form a ceramic chip, and then a metal layer (external electrode) is sealed on both ends of the chip. Thus forming a structure. [0003] With the development of multilayer ceramic capacitors to small size and large capacity, the dielectric of the capacitor continues to become thinner, and the ceramic diaphragm formed as a dielectric after sintering becomes thinner. Processing requirements are getting higher and higher. When the thickness of the ceramic dielectric diaphragm is small, one problem is that the diaphragm is light and carries a large amount of static electricity, so that the fou...

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Problems solved by technology

When the thickness of the ceramic dielectric diaphragm is small, one problem is that the diaphragm is light and carries a large amount of static electricity, so that the four corners of the diaphragm are folded up under the action of electrostatic force (called "folding corner") when stacking. If the corners are not detected and processed in time, it will lead to an increase in the scrap rate

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