Preparation method of polymer for packaging large-scale integrated circuit

A large-scale integrated circuit and polymer technology, applied in the field of large-scale integrated circuit packaging materials, can solve the problems of poor tensile strength, impact strength and bonding performance, achieve excellent weather resistance and electrical performance, low production cost, Enhance the effect of vibration cushioning

Inactive Publication Date: 2014-05-14
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantages are that the tensile stre...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] In terms of parts by mass, take 70 parts of α,ω-dihydroxy polydimethylsiloxane with a degree of polymerization of 10 and 30 parts of methyl vinyl MQ silicone resin with an M / Q value of 0.7 and a vinyl content of 3.0%. Put it into the reaction kettle, start stirring for 25 minutes, the speed is 65 rpm, the temperature is raised to 90°C, and the heating rate is 2°C / min; Add 0.03% of the mass part of methylsiloxane to potassium trimethylsiliconate as a catalyst, stir at a constant temperature for 2.5 hours, stop heating after the reactant turns into a transparent colloid, and continue stirring until cooling to room temperature to obtain product 1.

[0021] The main performance index of table 1 product 1

[0022] Performance name

Embodiment 2

[0024] According to the number of parts by mass, 80 parts of α, ω-hydroxypoly(dimethyl-methylvinyl) siloxane with a degree of polymerization of 15 and 20 parts of methyl MQ silicone resin were put into the reactor, and the stirring was started for 35 minutes. The rotation speed is 80 rpm, the temperature is raised to 85°C, and the heating rate is 2°C / min; Add 0.02% of the alkane mass part potassium trimethylsiliconate as a catalyst, stir at constant temperature for 1.5 hours, stop heating after the reactant turns into a transparent colloid, and continue stirring until cooling to room temperature to obtain product 2.

[0025] The main performance index of table 2 product 2

[0026] Performance name

Embodiment 3

[0028] According to the number of parts by mass, take 85 parts of α,ω-dihydroxy polydimethylsiloxane with a degree of polymerization of 20 and 15 parts of methyl vinyl MQ silicone resin with an M / Q value of 0.7 and put them into the reactor, and start stirring 35 minutes, the rotation speed is 60 rpm, the temperature is raised to 95°C, and the heating rate is 2°C / min; after the system is uniformly mixed and the temperature is stable, the mass parts Add 0.04% of sodium trimethylsiliconate as a catalyst, stir at constant temperature for 3 hours, stop heating after the reactant turns into a transparent colloid, and continue stirring until cooling to room temperature to obtain the product 3.

[0029] The main performance index of table 3 product 3

[0030] Performance name

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Abstract

The invention discloses a preparation method of a polymer for packaging a large-scale integrated circuit. The polymer comprises the main raw material of 95-65 parts by mass of alpha,omega-dihydroxyl polydimethylsiloxane or alpha,omega-hydroxyl poly(dimethyl-methylvinyl)silica with the polymerization degree of 5-30 and comprises the auxiliary raw material of 5-35 parts by mass of methylvinyl MQ silicon resin or methyl MQ silicon resin with the M/Q value of 0.6-0.9. The preparation method comprises the following steps: feeding the main raw material and the auxiliary raw material into a reaction kettle, and stirring for 20-60 minutes at a speed of 40-120 rpm; heating to 50-130 DEG C at a speed of 2 DEG C per minute; after the system is uniformly mixed and the temperature is stable, stirring at constant temperature for 1-4 hours in the presence of a catalyst, namely sodium trimethylsilanolate or potassium trimethylsilanolate accounting for 0.01%-0.1% of the mass parts of the main raw material; after the reactant turns into transparent colloid, stopping heating and continuously stirring until the reactant is cooled to room temperature to obtain the target product. The body resistance is higher than 1,013omega, the thermal conductivity is lower than 1.40W/mK, and the polymer can tolerate irradiation not lower than 109rad while good elasticity is still kept.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for large-scale integrated circuits, and in particular relates to a preparation method of a polymer silicone resin material. Background technique [0002] Packaging materials have a significant impact on the performance, stability and service life of integrated circuits. Especially for large-scale integrated circuits, due to its high-speed, multi-functional and miniaturized characteristics, under long-term high-current operating conditions, packaging materials are easily carbonized, forming conductive channels on the device surface, resulting in device failure. Epoxy resin materials currently used for large-scale integrated circuit packaging have high crosslinking density after curing, large internal stress, high brittleness, poor impact resistance, transparency decreases with increasing temperature, and carbonization reaction occurs when the temperature exceeds 150°C. [0003] In add...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08L83/07C08L83/04
Inventor 王育乔孙岳明印杰宋坤忠薛中群
Owner SOUTHEAST UNIV
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