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Ceramic packaging structure and pressure sensitive apparatus shell of ceramic packaging structure

A technology of ceramic packaging and sensitive devices, applied in the direction of measuring fluid pressure, instruments, measuring force, etc., can solve the problems of oxidation, pressure sensitive device shell thermomechanical stress, easy corrosion, etc., to achieve improved stability and excellent thermal conductivity , Improve the effect of high temperature resistance

Inactive Publication Date: 2014-04-30
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic package structure and a pressure sensitive device shell using the ceramic package structure; to solve the problems of the prior art or the existence of high temperature use that is easy to corrode and oxidize, or the pressure sensitive device shell is affected by thermomechanical stress question

Method used

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  • Ceramic packaging structure and pressure sensitive apparatus shell of ceramic packaging structure
  • Ceramic packaging structure and pressure sensitive apparatus shell of ceramic packaging structure

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specific Embodiment approach 1

[0010] Specific implementation mode 1: A ceramic packaging structure in this implementation mode, using ceramic (AL 2 o 3 The coefficient of linear expansion (20-1000°C) 7.1-7.7) is used as an insulating material, and the metallized layer is sintered on the ceramic surface at high temperature, and nickel or Ag-Cu solder is used as a transition material to sinter with metal shells with different characteristics to form a sealed structure.

[0011] Ceramic materials include Al 2 o 3 , SiC, BeO, TiO 2 , ZrO 2 , M g O, AlN, Si 3 N 4 Or BN and mixtures of all the above materials.

[0012] Materials for the metallization layer include tungsten, molybdenum or manganese and mixtures of all of the above materials.

[0013] When Ag-Cu is selected as the solder, the sintering temperature is 790°C.

specific Embodiment approach 2

[0014] Specific implementation mode two: the following combination figure 1 This embodiment will be specifically described. A pressure-sensitive device shell adopting a ceramic packaging structure in this embodiment includes a lead wire 1, a metallization layer 2, a sealing ring 3, solder 4, a ceramic body 5, a transition layer 6 and a socket 7, and the ceramic body 5 is fixed On the tube base 7, a metallized layer 2 is provided on the connection surface between the ceramic body 5 and the tube base 7, the ceramic body 5 and the metallized layer 2 are sintered into one at high temperature, and the solder 4 is passed between the metallized layer 2 and the tube base 7 The sintering effect forms the transition layer 6, the lead wire 1 runs through the ceramic body 5, and the outer surface of the ceramic body 5 in the direction where the lead wire 1 passes through the stem 7 is provided with a sealing ring 3, and the sealing ring 3 and the ceramic body 5 are sintered by solder 4 to...

specific Embodiment approach 3

[0020] Specific implementation mode three: this implementation mode is as follows figure 2 Shown: alumina ceramic body 5 and metallized layer 2 are sintered at high temperature in a vacuum environment; lead wire 1, seal ring 3, and tube base 7 are electroplated with nickel at the joint; lead wire 1, seal ring 3, tube base 7 and alumina Ceramic 7 is sintered by Ag-Cu solder 4 under protective atmosphere.

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Abstract

The invention provides a ceramic packaging structure and a pressure sensitive apparatus shell of the ceramic packaging structure, and relates to a packaging structure of the pressure sensitive apparatus shell, in particular to the pressure sensitive apparatus shell of the ceramic packaging structure. Accordingly, the problem that in the prior art, the pressure sensitive apparatus shell is prone to corrosion and oxidation when used at a high temperature or the pressure sensitive apparatus shell is influenced by thermal mechanical stress is solved. Ceramic is adopted to serve as an insulating material of the ceramic packaging structure, a metallization layer is sintered on the surface of the ceramic at a high temperature, and the metallization layer and a metal shell are sintered through solder, such as nickel or gold or Ag-Cu, serving as a transition material to form a sealing structure. The pressure sensitive apparatus shell comprises a lead, the metallization layer, a seal ring, the solder, a ceramic body, a transition layer and a tube base, wherein the metallization layer is arranged on the junction surface of the ceramic body and the tube base, the ceramic body and the metallization layer are sintered to form a whole under a high temperature, the transition layer is formed between the metallization layer and the tube base through the sintering effect of the solder, and the lead and the surface of an inner hole of the seal ring are sintered to form a whole through the solder.

Description

technical field [0001] The invention relates to the packaging structure of the pressure sensitive device tube shell, and also relates to the pressure sensitive device tube shell adopting the ceramic package structure. Background technique [0002] There are mainly two packaging methods for the existing pressure-sensitive device shells. One is to use the principle of matching the linear expansion coefficient of the material, relying on the metal oxide generated on the metal surface to be firmly attached to the metal surface, and at the same time be able to dissolve until it melts. In the glass, a transition layer with gradual composition is formed between the metal oxide layer and the glass, and the transition layer tightly bonds the glass and the metal oxide layer to realize the sealing of the glass and the metal; DM-308 glass (A kind of glass containing high boron composition, linear expansion coefficient (20-300℃) 4.7-5.0) as insulating material, sealed with iron-nickel-co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/00G01L19/14
Inventor 苗欣吴亚林苗佳依张杰张伟亮
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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