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Preparation method of aluminum alloy profile for high-power LED (light-emitting diode) lamp substrate

A technology of LED lamp substrate and aluminum alloy profiles, applied in the field of aluminum alloy material processing, can solve problems such as insufficient thermal conductivity and difficulty in meeting heat dissipation requirements, and achieves improved work reliability and service life, excellent heat dissipation performance, and reduced production costs. Effect

Inactive Publication Date: 2014-04-09
WUHU WANRUN MACHINERY
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  • Summary
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AI Technical Summary

Problems solved by technology

However, the current aluminum alloy profiles are obviously insufficient in thermal conductivity, especially for high-power LED lamps, it is difficult to meet their heat dissipation requirements

Method used

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Embodiment Construction

[0016] A method for preparing an aluminum alloy profile for a high-power LED lamp substrate, comprising the following steps:

[0017] (1) Meet the following requirements according to the mass percentage of elements: Si 1.2-1.8, Cu 2.6-3.4, Ag 0.5-1.0, Be 0.3-0.6, W 0.2-0.4, Mn 0.25-0.35, Zn 0.1-0.2, Ni 0.2-0.3 , Fe 0.05-0.15, Pd 0.03-0.07, Nd 0.02-0.04, Tb 0.01-0.02, the balance is Al for batching, put the charge into the melting furnace for melting at 745 ° C, add the charge until it is completely melted, stir for 30 minutes, and detect Alloy composition and adjustment; then add refining agent for refining, refining temperature is 730°C, refining time is 20min, after removing slag, let it stand for 25min, then adjust the temperature to 725°C, pass 80%N in the aluminum liquid 2 +10%Cl 2 +10%CO multi-component mixed gas degassing and refining for 20 minutes, the gas pressure is 0.2atm, and the gas flow rate is 1.8 m 3 / min, stand still for 25min, make the oxide slag f...

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Abstract

The invention discloses a preparation method of an aluminum alloy profile for a high-power LED (light-emitting diode) lamp substrate. The aluminum alloy profile comprises the following elements in percentage by mass: 1.2-1.8% of Si, 2.6-3.4% of Cu, 0.5-1.0% of Ag, 0.3-0.6% of Be, 0.2-0.4% of W, 0.25-0.35% of Mn, 0.1-0.2% of Zn, 0.2-0.3% of Ni, 0.05-0.15% of Fe, 0.03-0.07% of Pd, 0.02-0.04% of Nd, 0.01-0.02% of Tb and the balance of Al. The aluminum alloy profile has the advantages of high heat conductivity, excellent heat dispersion property and sufficient mechanical properties, and thus, is suitable for manufacturing the high-power LED lamp substrate. The aluminum alloy profile can improve the working reliability and service life of the LED lamp, lowers the production cost, and is suitable for industrial production and large-scale popularization.

Description

technical field [0001] The invention relates to a method for preparing an aluminum alloy section material for a high-power LED lamp substrate, and belongs to the technical field of aluminum alloy material processing. Background technique [0002] Aluminum alloy is the most widely used non-ferrous metal structural material in the industry. Because of its low density and relatively high strength, which is close to or exceeds high-quality steel, it has good plasticity, excellent electrical conductivity, thermal conductivity, and corrosion resistance. Processed into various profiles, widely used in machinery manufacturing, transportation machinery, power machinery and aviation industry, etc. [0003] High-power LED lamps have the advantages of power saving, long life and fast response time, and are widely used in urban landscapes, LCD backlight panels, traffic signs, automobile taillight lighting and advertising signs. Heat dissipation is one of the key technologies...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/18C22C1/06C22F1/057B21C23/02
Inventor 吴贤春
Owner WUHU WANRUN MACHINERY
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