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Thermosetting resin composition, b graded resin film, metal foil, copper-clad board and multi-layer lamination substrate

A resin composition and thermosetting technology, applied in the fields of thermosetting resin composition, B-stage resin film, metal foil, copper clad laminate and multilayer laminate substrate, can solve the problem of low resin fluidity, lower reliability than rigid materials, Tg lower problem

Inactive Publication Date: 2014-03-26
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these materials usually have low resin fluidity after molding, low Tg, and are not as reliable as rigid materials

Method used

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  • Thermosetting resin composition, b graded resin film, metal foil, copper-clad board and multi-layer lamination substrate
  • Thermosetting resin composition, b graded resin film, metal foil, copper-clad board and multi-layer lamination substrate
  • Thermosetting resin composition, b graded resin film, metal foil, copper-clad board and multi-layer lamination substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Prepared by 115 parts by weight of bisphenol A type epoxy resin Epiclon 850-S (manufactured by DIC Corporation, epoxy equivalent 188), 115 parts by weight of phenol novolak type epoxy resin Epiclon N-770 (manufactured by DIC Corporation, Epoxy equivalent 188), 95 parts by weight of 1,3-bis(4-aminophenoxybenzene) TPE-R (manufactured by Xihua Co., Ltd.), 200 parts by weight of soluble polyimide resin Q -VR-X0163 (manufactured by PI Technology Research Institute Co., Ltd., resin solid content 20% by weight), 367 parts by weight of phenoxy resin FENOTO-ERF-001M30 (manufactured by Nippon Steel Chemical Co., Ltd., resin solid content 30% by weight) , 25 parts by weight of HCA (manufactured by Sanko Co., Ltd.) to prepare a resin varnish with a resin solid content of 40% by weight.

Embodiment 2

[0072] Prepared by 105 parts by weight of bisphenol A type epoxy resin Epiclon 850-S (manufactured by DIC Corporation, epoxy equivalent 188), 105 parts by weight of phenol novolak type epoxy resin Epiclon N-770 (manufactured by DIC Corporation, Epoxy equivalent 188), 115 parts by weight of 2,2-bis[4-(4-aminophenoxy group) phenyl] propane BAPP (manufactured by Xihua Co., Ltd.), 200 parts by weight of soluble polyimide resin Q -VR-X0163 (manufactured by PI Technology Research Institute Co., Ltd., resin solid content 20% by weight), 367 parts by weight of phenoxy resin FENOTO-ERF-001M30 (manufactured by Nippon Steel Chemical Co., Ltd., resin solid content 30% by weight) , 25 parts by weight of HCA (manufactured by Sanko Co., Ltd.) to prepare a resin varnish with a resin solid content of 40% by weight.

Embodiment 3

[0074] Prepared by 115 parts by weight of bisphenol A type epoxy resin Epiclon 850-S (manufactured by DIC Corporation, epoxy equivalent 188), 115 parts by weight of phenol novolak type epoxy resin Epiclon N-770 (manufactured by DIC Corporation, Epoxy equivalent 188), 95 parts by weight of 1,3-bis(4-aminophenoxybenzene) TPE-R (manufactured by Xihua Co., Ltd.), 200 parts by weight of soluble polyimide resin Q-VR-X0163 (manufactured by PI Technology Research Institute Co., Ltd., resin solid content 20% by weight), 110 parts by weight of phenoxy resin Fenotto YP-70 (manufactured by Nippon Steel Chemical Co., Ltd.), 25 parts by weight of HCA (manufactured by Sanko Co., Ltd. ) to make a resin varnish with a resin solid content of 40% by weight.

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Abstract

The invention aims to provide an epoxy thermosetting resin composition that can be bent and have a film insulation layer, has reliability and processing characteristic that compare favourably with halogen-free FR-4, and is low in fluidity in a vacuum pressing process. The thermosetting resin composition includes (a1) liquid epoxy resin; (a2) solid epoxy resin; (b) aromatic diamidogen compound with ether group; (c) solvent soluble polyimide resin with weight-average molecular weight below 50000; and (d) phenoxy resin. The amount of (c) solvent soluble polyimide resin with weight-average molecular weight below 50000 and (d) phenoxy resin is more than 15 parts by weight and less than 100 parts by weight when the total amount of the (a1) liquid epoxy resin, (a2) solid epoxy resin, (b) aromatic diamidogen compound is arranged to be 100 parts by weight.

Description

technical field [0001] The present invention relates to resin flow that can be used in adhesives, prepregs, coatings, etc., to manufacture laminated substrates with a flexible substrate as a core material, a metal-based substrate with aluminum, etc. as a base A thermosetting resin composition with low resistance, and a B-staged resin film prepared using the thermosetting resin composition, coated on one side of a metal foil and B-staged, such as copper foil with an adhesive and a copper-clad board, etc., It can be used for high heat resistance, high adhesive strength, and high reliability high-density flexible laminated printed wiring boards that can be bent, integrally molded substrates, and heat dissipation substrates. The resulting printed wiring boards can be used for portable devices, LEDs, etc. substrates, module substrates, etc. Background technique [0002] In recent years, in order to achieve higher performance in portable devices and thinner LCD TVs, printed wirin...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/08C08L71/12C08G59/50C08J5/18B32B15/092B32B27/06B32B27/38B32B27/28
Inventor 棚桥祐介石坂将畅柿内直也
Owner TAMURA KK
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