A manufacturing method and product of a flexible circuit board with suspended plug fingers
A technology for flexible circuit boards and manufacturing methods, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuit components, etc., can solve problems that affect product yield, poor reliability, and easy pinning of PIN pins, etc. , to achieve the effect of improving the strength and reliability of conductivity, satisfying the bending performance, and simple manufacturing process
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[0044] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.
[0045] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.
[0046] The invention provides a method for manufacturing a flexible circuit board with suspended fingers and a flexible circuit board produced by the method. The method includes the following steps:
[0047] a. Prepare...
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