Fast curing thermosetting conductive silver adhesive

A conductive silver glue, fast curing technology, used in conductive adhesives, adhesives, epoxy resin glue, etc., to achieve the effect of reducing curing time

Active Publication Date: 2014-03-19
湖南省和祥润新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The curing time of the conductive adhesive in the prior art is long. On the one hand, it is difficult to meet the occasions that require fast curing. On the other hand, the long curing time will lead to a long production cycle, which is not conducive to saving production costs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A fast-curing thermosetting conductive silver glue, its components and parts by weight are: 20 parts of epoxy resin, 10 parts of 4,4'-diaminodiphenylmethane, 0.5 parts of benzyl alcohol modified imidazole compounds, 3 μm flake 60 parts of silver powder. The obtained conductive silver glue has a curing time of 5 minutes and a volume resistance of 3×10 -4 Ohm centimeters, the bond strength is 11MPa.

Embodiment 2

[0015] A fast-curing thermosetting conductive silver glue, its components and parts by weight are: 20 parts of epoxy resin, 15 parts of 4,4'-diaminodiphenyl sulfone, 1 part of benzyl alcohol modified imidazole compound, 4 μm sheet 65 parts of silver powder. The curing time of the obtained conductive silver glue is 4.5min, and the volume resistance is 4×10 -4 Ohm centimeters, the bond strength is 12MPa.

Embodiment 3

[0017] A fast-curing thermosetting conductive silver glue, its components and parts by weight are: 20 parts of epoxy resin, 20 parts of 4,4'-diaminodiphenyl sulfone, 1.5 parts of benzyl alcohol modified imidazole compounds, 5 μm sheet 60 parts of silver powder. The obtained conductive silver glue had a curing time of 4.3 minutes and a volume resistance of 4.4×10 -4 Ohm centimeters, the bond strength is 11MPa.

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Abstract

The invention discloses a fast curing thermosetting conductive silver adhesive. The silver adhesive comprises a base resin, a curing agent, a curing accelerator and a conductive material. The silver adhesive is characterized in that: the base resin is epoxy resin, the curing agent is an aromatic polyamine curing agent, the curing accelerator is a phenylcarbinol-modified imidazole compound, and the conductive material is silver powder. The thermosetting conductive silver adhesive can effectively reduce the curing time.

Description

technical field [0001] The invention relates to a fast-curing thermosetting conductive silver glue, which belongs to the field of electronic materials. technical background [0002] Conductive silver glue is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. The curing time of the conductive adhesive in the prior art is long. On the one hand, it is difficult to meet the occasions that require fast curing. On the other hand, the long curing time will lead to a long production cycle, which is not conducive to saving production costs. Contents of the invention [0003] The purpose of the present invention is to provide a thermosetting conductive silver adhesive capable of fast curing. [0004] In order to achieve the above object, a kind of fast-curing thermosetting conductive silver glue of the present invention comprises base resin, curing agent, curing accelerator and conductive materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/04C09J11/06
Inventor 苏建丽
Owner 湖南省和祥润新材料有限公司
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