A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip

A production process and technology of lead-free solder, which is applied in the field of zinc-nickel-nickel strip processing, can solve the problems of unstable performance of lead-free solder, low test pass rate, small tin pulling force, etc., to improve the performance of finished lead-free solder, improve Lead-free solder performance, effect of improvement of lead-free solder performance

Active Publication Date: 2016-04-06
安徽鑫科铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The zinc-nickel-nickel strip products produced by the prior art have unstable lead-free solder properties, usually poor wettability, small tin pull force, low test pass rate, and low yield

Method used

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  • A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip
  • A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip
  • A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip

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Effect test

Embodiment 1

[0035] The production process for improving the performance of lead-free soldering of zinc-nickel-nickel strips. The production process of zinc-nickel-nickel strips is: casting→face milling→rough rolling→edge trimming→intermediate annealing→degreasing cleaning→intermediate rolling→intermediate annealing→degreasing cleaning→finished product Rolling→annealing of finished products→bending and straightening→cleaning of finished products→strip storage, the rolling processing rate of finished products is 30%~45%, and the surface roughness of the rolls used for rolling of finished products is 0.1μm≤Ra≤0.3μm; In the annealing process, the annealing temperature is set at 425-535°C and kept at this temperature for 7-12 hours; in the finished product cleaning process, the mass concentration of the finished product cleaning acid is controlled at 4-9%.

[0036] The annealing of the finished product is preferably carried out in the annealing furnace, and the gas atmosphere in the annealing f...

Embodiment 2

[0039] The processing technology for improving the performance of lead-free soldering of zinc-nickel-nickel strips. The production process of zinc-nickel-nickel strips is: casting→face milling→rough rolling→edge trimming→intermediate annealing→degreasing and cleaning→intermediate rolling→intermediate annealing→degreasing and cleaning→ Finished product rolling→finished product annealing→stretch bending straightening→finished product cleaning→strip warehousing; the finished product is rolled with a processing rate of 45%; the finished product is rolled with a roll with a surface roughness Ra=0.3μm; the finished product is annealed in an annealing furnace Carry out, the temperature is set at 440°C, and the gas atmosphere in the annealing furnace is 75%H 2 +25%N 2 , and heat treatment at this temperature for 12 hours, and the finished product is cleaned with an acid solution of H 2 SO 4 , the acid concentration is 9%.

[0040] The lead-free solder test results of zinc-nickel-ni...

Embodiment 3

[0042] The processing technology for improving the performance of lead-free soldering of zinc-nickel-nickel strips. The production process of zinc-nickel-nickel strips is: casting→face milling→rough rolling→edge trimming→intermediate annealing→degreasing and cleaning→intermediate rolling→intermediate annealing→degreasing and cleaning→ Finished product rolling→finished product annealing→stretch bending straightening→finished product cleaning→strip warehousing; the finished product is rolled with a processing rate of 35%; the finished product is rolled with a roll with a surface roughness Ra=0.2μm; the finished product is annealed in an annealing furnace Carry out, the temperature is set at 490°C, and the gas atmosphere in the annealing furnace is 75%H 2 +25%N 2 , and heat treatment at this temperature for 10 hours, and the finished product is cleaned with an acid solution of H 2 SO 4 , the acid concentration is 6%.

[0043] For the test results of lead-free solder on zinc-ni...

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Abstract

The invention discloses a manufacturing technology for improving a Pb-free solder property of a packfong strip. The manufacturing technology of the packfong strip comprises the steps of casting, surface milling, rough rolling, edge cutting, intermediate annealing, degreasing and cleaning, intermediate rolling, intermediate annealing, degreasing and cleaning, finished product rolling, finished product annealing, stretch bending and straightening, finished product cleaning and itemizing and storing, the finished product rolling working rate is 30 to 45%, and the roller surface roughness Ra adopted in the finished product rolling is less than or equal to 0.1[mu]m and larger than or equal to 0.3 [mu]m; the annealing temperature of the finished product is set to be 425 to 535 DEG C, and heat preservation is performed for 7 to 12 hours at the temperature; the concentration of the finished product cleaning acid liquor is controlled to be 4 to 9%; all of the finished product rolling, the finished product annealing and the finished product acid liquor cleaning improve the Pb-free solder property of the packfong strip.

Description

technical field [0001] The invention relates to the technical field of zinc-nickel-nickel strip material processing, in particular to a processing technology for improving the performance of lead-free soldering of zinc-nickel-nickel strip material. Background technique [0002] With the introduction of the concept of environmental protection, many electronic product manufacturers have canceled the lead soldering process of electronic connectors and changed it to lead-free soldering process, which puts forward extremely high requirements on the soldering performance of materials. The index of lead-free solder performance of zinc white copper strip was proposed in the domestic market in recent years, and its test conditions are as follows: [0003] Solder ball temperature: 255°C; [0004] Flux: 5#; [0005] Breakthrough tension time (Tb): 0.6s; [0006] F1: When soaking for 1 second, the force value should be greater than 0.27mN; [0007] F2: When soaking for 5 seconds, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08
Inventor 宣夕文杨建设李震宇谢宁左悦铭
Owner 安徽鑫科铜业有限公司
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