Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ferrite substrate cleaning technology method based on neutral solution

A technology of neutral solution and process method, which is applied in the field of micromachining, can solve the problems such as difficult cleaning of ferrite substrates, and achieve the effect of easy recycling and easier removal

Active Publication Date: 2014-03-12
SOUTHWEST INST OF APPLIED MAGNETICS
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems in the prior art, the present invention provides a cleaning process for ferrite substrates based on a neutral solution, which solves the problem that it is not easy to clean ferrite substrates in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] (1) Polish the side and non-exposed surface of the substrate with filter paper, and there are no obvious impurity particles on the side and non-polished surface.

[0060] (2) Place the substrate flat in a glass container or a stainless steel container, and use tap water, absolute ethanol, and 3% washing powder solution as cleaning agents in sequence. The solution should be 5mm higher than the surface of the substrate. Adjust the power of the ultrasonic cleaner to 120W, the frequency is 60KHz to ultrasonic the substrate for 11 minutes;

[0061] (3) Put the substrate in a ceramic crucible and use 50 o C Rinse the substrate with hot water.

[0062] (4) Put the substrate in a crystallization dish, use sorbose with a heavy metal content of less than 0.001%, deionized water with a resistance greater than 18Ω, absolute ethanol, and acetone as cleaning agents in sequence. The solution should be 5mm higher than the surface of the substrate. Adjust The power of the ultrasonic c...

Embodiment 2-5

[0066] According to the method and steps of Example 1, but the ethanol in step (2) and step (4) is changed to n-butanol, n-hexanol, n-octanol, n-decyl alcohol.

Embodiment 6

[0068] Follow the method and steps of Example 1, but change the parameter settings of the ultrasonic cleaning machine in steps (2) and (4) to: the power is 200W, the time is 20 minutes, and the frequency is 100KHz.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistanceaaaaaaaaaa
electrical resistanceaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of micromachining, in particular to a ferrite substrate cleaning technology based on a neutral solution. The technology includes the following steps that a substrate side and a non-exposed face are ground, a substrate is horizontally placed in an utensil, a cleaning agent is used for carrying out ultrasonic treatment on the substrate in an ultrasonic cleaning machine; the substrate is placed in a ceramic crucible and flushed with hot water; microcleaning is carried out on the surface of the substrate. The ferrite substrate cleaning technology based on the neutral solution has the advantages that impurities such as oil contamination can be effectively removed, reaction with the ferrite substrate does not exist, in addition, alcohol and ketone anhydrous organic solvents are easy to recycle and the environment will not be polluted.

Description

technical field [0001] The invention relates to the field of micromachining, in particular to a cleaning process for a ferrite substrate based on a neutral solution. Background technique [0002] Microwave ferrite thin film circuit devices (such as circulators / isolators) are widely used in the field of microwave communications. Due to the advantages of small size, light weight, less consumables, and easy integration, they are widely used in communication base stations, satellites, radars, and electronic countermeasures. And many other civilian and military equipment play an important role. The integrated ferrite thin film circuit device meets the development of electronic information technology, especially the communication industry, and the system requirements of military complete machines in recent years, such as lightness, high performance and high reliability. According to the literature reports, in the process of film growth, the surface of the film layer is a reprodu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/12B08B3/10B08B3/08
CPCB08B3/08B08B3/106B08B3/12
Inventor 邹延珂陈彦王喜生倪经周俊黄豹曹照亮李晓静
Owner SOUTHWEST INST OF APPLIED MAGNETICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products