Solar cell piece PID (potential induced degradation) test device and test method

Abstract

The invention relates to a solar cell piece potential induced degradation (PID) test device and a test method. The test device comprises a direct current voltage device, a resistance tester, a metal electrode array and a metal tray. The test method comprises the following steps: (1). a cell piece is placed on the metal tray, a temperature is controlled to be 0 to 100 DEG C and humidity to be 0 to 100%; (2). the direct current voltage device opens so that an ion flow is applied to a surface of the solar cell piece; (3) ion radiation continues and cell piece parallel resistance changes are tested in a real-time manner; and (4) a curve chart is made for recording the parallel resistance changes. In the invention, the parallel resistance of the solar cell piece is tested directly, and the anti PID effect is determined, i.e. the anti PID effect test at the solar cell terminal is conducted, so that the test cost and test time are saved; the timely optimization of the anti PID cell production process is facilitated; and an effective monitoring is realized at the same time.

Description

technical field [0001] The invention belongs to the field of crystalline silicon solar cell manufacturing, and in particular relates to a solar cell potential-induced decay (PID) testing device and testing method. Background technique [0002] The PID (Potential Induced Degradation) effect is called the high-voltage induced attenuation effect, and it is a relatively new attenuation effect that has appeared in the photovoltaic field in recent years. [0003] With the gradual promotion and application of photovoltaic grid-connected systems, the system voltage is getting higher and higher, commonly used are 600V and 1000V. The pressure of the cells inside the module relative to the ground is getting higher and higher, and some even reach 600-1000V. Generally, the aluminum frame of the module is required to be grounded, so that a high voltage of 600-1000V is formed between the battery sheet and the aluminum frame. Generally speaking, during the lamination process of component ...

AI Technical Summary

Problems solved by technology

Since the component manufacturing process and packaging materials also have a great influence on the PID effect of the component, the PID test result of the component cannot directly reflect whether the cell is resistant to the PID effect, and the PID test cycle of the component is long and the process is complicated. Therefore, the PID test method at the battery end has become an effective method to solve the above problems

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