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Preparation method of epoxy composite material with low packing content, high thermal conductivity and ternary nano/micro structure

A composite material and epoxy technology, applied in the field of epoxy composite material preparation, can solve the problems of deteriorating mechanical and processing properties, high filler content of composite materials, weak thermal conductivity, etc., achieve excellent mechanical and processing properties, and reduce manufacturing costs. , the effect of a complete thermal network

Active Publication Date: 2014-01-22
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

New high intrinsic thermal conductivity carbon fillers, such as graphene, carbon nanotubes, etc., are currently difficult to realize industrialization due to their high cost. These fillers are also good conductors of electricity, which also limits the application of corresponding composite materials in insulating environments.
Although the cost of traditional thermally conductive fillers is relatively low, due to the weak intrinsic thermal conductivity, the corresponding composite material has a high filler content, which not only increases the cost, but more importantly, deteriorates the mechanical and processing properties

Method used

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  • Preparation method of epoxy composite material with low packing content, high thermal conductivity and ternary nano/micro structure
  • Preparation method of epoxy composite material with low packing content, high thermal conductivity and ternary nano/micro structure
  • Preparation method of epoxy composite material with low packing content, high thermal conductivity and ternary nano/micro structure

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Embodiment 1

[0033] This embodiment relates to a method for preparing a low filler content, high thermal conductivity ternary nano-microstructure epoxy composite material, comprising the following steps:

[0034] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0035] Weigh 2g Al 2 o 3 , fully dispersed in 100mL xylene, then added 1wt% γ-APS and stirred and refluxed for 1h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS. BN undergoes two steps of pretreatment before grafting silane coupling agent: first, weigh 2g of BN, stir and disperse in 100mL of 30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash with deionized water for 3 times; Acidified BN was added to 50mL of 30wt% hydrogen peroxide, reacted at 50°C for 1h, then continued to heat up to 75°C for 1h, and the product was centrifuged and dried in vacuum a...

Embodiment 2

[0041] This embodiment relates to a method for preparing a low filler content, high thermal conductivity ternary nano-microstructure epoxy composite material, comprising the following steps:

[0042] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0043] Weigh 5g Al 2 o 3 , fully dispersed in 200mL xylene, then added 2wt% γ-APS and stirred and refluxed for 2h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS. BN undergoes two steps of pretreatment before grafting silane coupling agent: first, weigh 5g of BN, stir and disperse in 200mL of 30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash with deionized water for 3 times; Acidified BN was added to 100mL 30wt% hydrogen peroxide, reacted at 50°C for 1h, then continued to heat up to 75°C for 1h, the product was centrifuged and dried in vacuum at 50°C...

Embodiment 3

[0049] This embodiment relates to a method for preparing a low filler content, high thermal conductivity ternary nano-microstructure epoxy composite material, comprising the following steps:

[0050] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0051] Weigh 2g Al 2 o 3 , fully dispersed in 100mL xylene, then added 1wt% γ-APS and stirred and refluxed for 1h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS. BN undergoes two steps of pretreatment before grafting silane coupling agent: first, weigh 2g of BN, stir and disperse in 100mL of 30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash with deionized water for 3 times; Acidified BN was added to 50mL of 30wt% hydrogen peroxide, reacted at 50°C for 1h, then continued to heat up to 75°C for 1h, and the product was centrifuged and dried in vacuum a...

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Abstract

The invention relates to a preparation method of an epoxy composite material with low packing content, high thermal conductivity and a ternary nano / micro structure. The preparation method comprises the following steps of modifying through a silane coupling agent gamma-APS (Aminopropyltriethoxysilane), and introducing amino groups on the surfaces of Al2O3 and h-BN; grafting hyperbranched aromatic polyamide (HBP) on the surface of initially modified packing by taking grafted amino groups as an active site to obtain modified packing Al2O3-HBP and BN-HBP; sufficiently mixing the two kinds of modified packing and an epoxy resin matrix according to a certain proportion and content; preparing the epoxy composite material with the ternary nano / micro structure by using a two step-by-step heating and curing methods. The heat conducting property of the epoxy composite material provided by the invention has a remarkable synergistic effect, the heat conductivity coefficient of a system can be regulated through changing the proportion of the packing, the epoxy composite material has a high heat conductivity coefficient under low packing content, the favorable mechanical and processing performances of the composite material of a polymer are kept, and the cost is greatly reduced.

Description

technical field [0001] The invention relates to a preparation method of an epoxy composite material, in particular to a preparation method of a ternary nano-microstructure epoxy composite material with low filler content and high thermal conductivity. Background technique [0002] With the rapid development of microelectronics integration and assembly technology, the volume of electronic components and logic circuits is getting smaller and smaller. At the same time, the operating frequency is increasing sharply, which causes the ambient temperature of semiconductors to change to high temperature. In order to ensure the long-term reliability of electronic components Work, timely heat dissipation ability becomes the restricting factor of its service life. In addition, many manufacturing and high-tech fields such as electrical appliances, LED lighting, aerospace, military equipment, etc. are also in urgent need of materials with excellent thermal conductivity. Polymer material...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K9/04C08K9/02C08K3/22C08K3/38C08K3/08C08K3/04C08K3/28C08K3/36C08K3/34
Inventor 方立骏钱荣谢礼源杨科侯世杰朱铭江平开
Owner SHANGHAI JIAO TONG UNIV
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