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Method for processing grooves on printed circuit board, printed circuit board and electronic device

A technology for printed circuit boards and processing slots, which is applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve problems such as unfavorable product cost control, hinder PCB miniaturization and integration, and promote PCB miniaturization and high integration The effect of shortening the processing cycle, reducing the overall volume and weight

Active Publication Date: 2016-08-03
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Practice has found that the existing cooling solutions for components hinder the miniaturization and integration of PCBs, and are not conducive to product cost control

Method used

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  • Method for processing grooves on printed circuit board, printed circuit board and electronic device
  • Method for processing grooves on printed circuit board, printed circuit board and electronic device
  • Method for processing grooves on printed circuit board, printed circuit board and electronic device

Examples

Experimental program
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Effect test

Embodiment Construction

[0070] Embodiments of the present invention provide a method for processing grooves on a printed circuit board, the printed circuit board and electronic equipment, in order to promote product miniaturization and integration and cost control.

[0071] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0072] The following describes in detail respectively through the examples.

[0073] see figure 1 , figure 1 It is an example of a component heat dissipation structure of a common PCB, wherein a heat dissipation metal plate...

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PUM

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Abstract

The embodiment of the invention discloses a method for processing grooves on a printed circuit board, the printed circuit board and electronic equipment. Among them, a method for processing grooves on a printed circuit board includes: processing a groove matching the size of the heat dissipation metal base on the first plate set; In the groove; press the second plate set and the first plate set to form the third plate set; groove from the surface of the second plate set after pressing to form a blind groove for installing components, wherein the blind Part or all of the bottom surface of the groove is located on the heat dissipation metal base, and at least one surface of the heat dissipation metal base is exposed, wherein the depth of the blind groove in the direction perpendicular to the surface of the third plate set is greater than the thickness of the pressed second plate set. The solutions provided by the embodiments of the present invention are beneficial to promote product miniaturization and integration and cost control.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a method for processing grooves on the printed circuit board, the printed circuit board and electronic equipment. Background technique [0002] It is applied to high heating components such as power amplifiers (PA, PowerAmplifier) ​​in many electronic devices. For example, PA is applied in high-power wireless base stations. The core of PA lies in matching design, heat dissipation design, linearity, consistency and efficiency, etc. Among them, except for matching, other characteristics are closely related to heat dissipation. Heat dissipation is a major factor affecting efficiency and linearity. Among the existing heat dissipation solutions for components, the heat dissipation metal-based printed circuit board (PCB, Printed Circuit Board) is a more effective solution. Among them, the existing heat dissipation metal-based PCB is on the PCB carrying PA or other co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/30H05K1/02
Inventor 李传智缪桦谢占昊
Owner WUXI SHENNAN CIRCUITS CO LTD
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