A kind of cyanide-free silver plating solution additive
A cyanide-free silver plating and additive technology, which is applied in the field of cyanide-free silver plating solution additives, can solve the problems of great health damage to operators, unfavorable environmental protection of sewage, etc., and achieve the effect of bright and meticulous plating, excellent binding force and good dispersion ability
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Embodiment 1
[0017] Embodiment 1: a kind of cyanide-free silver plating solution additive, its component information is as follows:
[0018] 22 bipyridine 5g / l;
[0019] Diethylenetriamine 0.2g / l;
[0020] 1-naphthol 5g / l;
[0021] Disodium edetate 400g / l;
[0022] The above components are formulated into cyanide-free silver plating additives with deionized water.
[0023] The working solution process parameters are as follows:
[0024] Silver nitrate 40g / l
[0025] 55 Dimethylhydantoin 120g / l
[0026] Anhydrous potassium carbonate 80g / l
[0027] Potassium nitrate 25g / l
[0028] Additive 100ml / l
[0029] Adjust the pH of the solution to 10.5 with nitric acid or potassium hydroxide, and the temperature is 25°C. Immerse the copper parts in the electroplating solution, and electroplate the copper parts with a current density of 0.6A / dm2. The electroplating time is 10 minutes. The silver layer obtained is bright and fine, and has good bonding force with the substrate. Baking at 200°C ...
Embodiment 2
[0031] Embodiment 2: a kind of cyanide-free silver plating solution additive, its component information is as follows:
[0032] 1,10-Phenanthroline 8g / l
[0033] 1-Methylnaphthalene 5g / l
[0034] Niacin 200g / l
[0035] Potassium pyrophosphate 200g / l
[0036] The above components are formulated into cyanide-free silver plating additives with deionized water.
[0037] The working solution process parameters are as follows:
[0038] Silver nitrate 40g / l
[0039] 55 Dimethylhydantoin 120g / l
[0040] Anhydrous potassium carbonate 80g / l
[0041] Potassium nitrate 25g / l
[0042] Additive 100ml / l
[0043] Adjust the pH of the solution to 9.0 with nitric acid or potassium hydroxide, and the temperature is 25°C. Immerse the copper parts in the electroplating solution, and electroplate the copper parts with a current density of 1.0A / dm2. The electroplating time is 10 minutes. The silver layer obtained is bright and fine, and has good bonding force with the substrate. Baking at 2...
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