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Copper based super-hydrophobic surface with low friction coefficient and preparation method thereof

A low friction coefficient, super-hydrophobic surface technology, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve the problems of unstable and easy decomposition of hydrogen peroxide, complex electrochemical process, complex method, etc. It has the advantages of cheap and easy availability of medicines, improved hydrophobicity and tribological properties, and simple preparation method.

Active Publication Date: 2013-12-25
XUCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

"Chem.Mater." 2007,19,5758-5764 published a paper entitled "Superhydrophobicity of3D Porous Copper Films Prepared Using the Hydrogen Bubble Dynamic Template" (Y.Li, W.Z.Jia, Y.Y.Song, X.H.Xia.Chem.Mater .), using the electrochemical deposition method to build a 3D porous micro-nano composite structure on the copper surface, but this method is more complicated, and the deposited gold is a precious metal, and the cost is high
"Mater. Lett." 2012,67,327-330 published a paper entitled "Preparation of super-hydrophobic Cu / Ni coating with micro-nano hierarchical structure" (W.J.Zhang, Z.Y.Yu, Z.Chen, M.Li.Mater .Lett.), using electroless plating and electrochemical deposition methods to build a Cu / Ni composite coating with a micro-nano hierarchical structure on the copper surface, this electrochemical process is also relatively complicated
"Appl.Surf.Sci." 2010,256,1883-1887 published a paper entitled "Fabrication of superhydrophobic copper surface with ultra-low water roll angle" (Y.F.Zhang, X.Q.Yu, Q.H.Zhou, F.Chen, K.N. Li.Appl.Surf.Sci.), using a simple sandblasting and surface oxidation process to construct a two-dimensional micro-nano rough structure on the surface of copper sheet. This process is relatively simple, but it uses fluorosilane for surface chemical modification. The environment has a certain degree of pollution
"Appl.Surf.Sci." 2012,258,6531-6536 published a paper entitled "Study on fabrication of the superhydrophobic sol-gel films based on copper wafer and its anti-corrosive properties" (Y.H.Fan, C.Z.Li, Z.J.Chen, H.Chen.Appl.Surf.Sci.), prepared a superhydrophobic surface on a copper substrate by a simple one-step sol-gel catalytic process. This method is simple to operate, but the ammonia reagent used has certain effects on the human body the poison of
"J.Phys.Chem.C." 2012,116,18722-18727 published a paper entitled "Facile Fabrication of a Superhydrophobic Cu Surface via a Selective Etching of High-Energy Facets" (L.J.Liu, F.Y.Xu, L. Ma.J.Phys.Chem.C.) used a simple one-step selective acid etching technique to prepare rough superhydrophobic surfaces on copper sheets, but the etchant used in the reaction was added with hydrogen peroxide, which was unstable and easy to Decomposition, there is a certain risk, and the cost is high

Method used

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  • Copper based super-hydrophobic surface with low friction coefficient and preparation method thereof
  • Copper based super-hydrophobic surface with low friction coefficient and preparation method thereof
  • Copper based super-hydrophobic surface with low friction coefficient and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0029] (1) Take copper flakes (produced by Sinopharm Group) with a thickness of 0.15-0.25mm and a purity of 99.99% as the copper-based material, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10s, then washed with deionized water, dried with nitrogen gas, and set aside.

[0030] (2) Soak the copper sheet treated in step (1) at 40°C in hydrochloric acid with a concentration of 2mol L -1 and ammonium persulfate concentration is 0.1mol L -1 The etching reaction was carried out for 1 h in the mixed solution, and a solid surface with a micron-scale pit structure was obtained.

[0031] (3) Soak the copper sheet treated in step (2) in 0.00031mol L at 23°C -1 silver nitrate solution for 5 hours, washed with deionized water, and dried to obtain a copper sheet with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles.

[0032] (4) Through surface modification, the copper sheet with micron-scale pit structure a...

Embodiment 2

[0035] (1) Take copper with a thickness of 1.5-2mm and a purity of 99% as the substrate, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10 seconds, cleaned, and dried with nitrogen gas for later use.

[0036] (2) Soak the copper treated in step (1) in hydrochloric acid with a concentration of 4mol L at a temperature of 10°C -1 , the concentration of potassium persulfate is 0.5mol L -1 The etching reaction was carried out in the mixed solution of 2h, and a solid surface with a micron-scale pit structure was obtained.

[0037] (3) Soak the copper sheet treated in step (2) at 10°C in a concentration of 0.0002mol L -1 in the silver nitrate solution for 4 hours, washed with deionized water, and dried to obtain copper with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles.

[0038] (4) Using surface modification, the copper with micron-scale pit structure and sub-micron / nano-scale metal silver particle ...

Embodiment 3

[0041] (1) Take a copper sheet (produced by Sinopharm Group) with a thickness of 0.15-0.25mm and a purity of 99.99% as the substrate, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10 seconds, cleaned, and dried with nitrogen gas for later use.

[0042] (2) Soak the copper sheet treated in step (1) in hydrochloric acid with a concentration of 2mol L at a temperature of 23°C -1 , the concentration of ammonium persulfate is 0.1mol L -1 4h in the mixed etching solution to obtain a solid surface with a micron-scale pit structure;

[0043] (3) Soak the copper sheet treated in step (2) in 0.00031mol L at 23°C -1 In the silver nitrate solution for 5h, wash with deionized water to obtain a copper sheet with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles;

[0044] (4) Using surface modification, the copper sheet with micron-scale pit structure and sub-micron / nano-scale metal silver particle rough struct...

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Abstract

The invention relates to a copper based super-hydrophobic surface with a low friction coefficient and a preparation method thereof. The copper based super-hydrophobic surface with a low friction coefficient is characterized in that chemical etching is performed on the surface of a copper based material to form a coarse structure with a micron-scale pit structure and submicron / nano-scale metal silver particles, and then a product is obtained through surface chemical modification. The copper based super-hydrophobic surface with low friction coefficient has a contact angle of more than 150 degrees to water, is low in friction coefficient, can be stably maintained, and has good super-hydrophobic properties and low friction coefficient.

Description

technical field [0001] The invention belongs to the field of preparing micron or / and nanostructures on solid surfaces, and in particular relates to a copper-based super-hydrophobic surface with a low coefficient of friction and a preparation method thereof. Background technique [0002] Wettability is one of the important properties of solid surfaces, and superhydrophobicity, as one of its manifestations, has very important potential application value, which has attracted extensive attention of researchers and achieved great results. [0003] Generally, there are two main methods to improve the hydrophobicity of solid surfaces: one is to chemically modify the rough surface with substances with low surface energy such as fluorine-containing compounds; the other is to increase the surface roughness of low surface energy substances. As an important engineering material, metallic copper plays an important role in people's daily life and industrial production. However, its corro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F17/00C23F1/00C23C18/42
Inventor 陈新华李佩佩郭丽丽张万强侯珂珂孙婷武小满张艳鸽张平余
Owner XUCHANG UNIV
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