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Substrate positioning and processing method and substrate positioning and processing device

A processing method and processing device technology, applied in the direction of the work carrier, can solve the problem of not being able to position and grind multiple substrates at one time, and achieve the effects of improving processing efficiency and utilization rate, improving utilization rate, and improving efficiency

Inactive Publication Date: 2013-12-18
RAY STAR OPTICAL SOLUTIONS XIAMEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention applies the principle of magnetic field effect to improve the positioning procedure of the substrate, and then solves the problem that the jig cannot position multiple substrates at a single position for grinding

Method used

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  • Substrate positioning and processing method and substrate positioning and processing device
  • Substrate positioning and processing method and substrate positioning and processing device
  • Substrate positioning and processing method and substrate positioning and processing device

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Embodiment Construction

[0039] The purpose of implementing the substrate positioning and processing method and device of the present invention is to firmly position the substrate on the processing tool before processing the substrate, so as to facilitate the processing. The substrate can be, for example, a substrate used for touch control or protection purposes, or a substrate used for solar panels. These substrates are usually made of glass, and therefore can also be referred to as glass substrates. Since the glass substrate itself does not have the characteristics of magnetic conductivity (that is, it is non-magnetic) and can be passed through by magnetic lines of force, it is suitable to be placed in a magnetic field environment without being disturbed by magnetic lines of force. In addition, the processing tool may be, for example, a grinding tool used for grinding the peripheral edges of the glass substrate. However, the actual substrates and processing tools are not limited to the above, and are...

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Abstract

The invention provides a substrate positioning and processing method. The method includes placing at least one non-magnetoconductivity substrate on a jig with a magnetizer; superposing at least one magnetoconductivity partition plates to press the substrates; turning on a magnetic switch on the jig, wherein the jig and the partition palates are attracted mutually to enable the substrates located between the jig and the partition plates to be positioned on the jig; using a tool to process the substrates. The invention further provides a substrate positioning and processing device so as to facilitate one-time processing of multiple substrates superposed and positioned at one time.

Description

Technical field [0001] The present invention relates to the technical field of substrate processing, in particular to a method and device for positioning a substrate on a processing machine. Background technique [0002] Generally speaking, the substrate of an electronic device can be a touch substrate or a protective substrate (Cover Lens) of a touch panel with an array of sensing electrodes, or it can be commonly used as a solar panel. (Solar Panel) used substrate. The above-mentioned substrates are usually made of glass with good light transmittance. In addition, in some specific applications, the substrate can also be made of hard rubber or other hard materials. [0003] The above-mentioned substrates must be cut into required specifications according to the needs of users during the processing and manufacturing process. Since the cut substrate has sharp end corners formed on its peripheral edges, the processing industry usually uses a grinding machine to grind the substrate...

Claims

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Application Information

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IPC IPC(8): B24B37/27
Inventor 朱小荣廖文军钟超阳
Owner RAY STAR OPTICAL SOLUTIONS XIAMEN
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