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Polyamide and polyamide composition

A technology of polyamide and diamine, applied in the field of polyamide and polyamide composition, can solve the problem of difficulty in obtaining molded products, and achieve the effects of excellent heat-resistant reflow solderability and excellent fogging properties

Active Publication Date: 2013-11-20
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, PA6T is a high-melting polyamide with a melting point of about 370°C, so even if one tries to obtain a molded product by melt molding, the polyamide undergoes severe thermal decomposition, making it difficult to obtain a molded product with sufficient properties

Method used

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  • Polyamide and polyamide composition
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  • Polyamide and polyamide composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0417] The polyamide polymerization reaction is carried out by the "prepolymer-solid-phase polymerization method".

[0418] (a) 896 g (5.20 mol) of CHDA and (b) 604 g (5.20 mol) of 2MPD were dissolved in 1500 g of distilled water to prepare a 50% by mass aqueous solution containing equimolar raw material monomers.

[0419] The resulting aqueous solution and 2MPD 18g (0.16 mol) as an additive during polymerization were put into an autoclave with an internal volume of 5.4L (Nitto High Pressure), and kept warm until the liquid temperature (internal temperature) reached 50°C, and then the inside of the autoclave was Replace with nitrogen.

[0420] Continue heating from the liquid temperature of about 50°C until the pressure in the tank of the autoclave reaches about 2.5kg / cm2 in terms of gauge pressure (hereinafter, the pressure in the tank is all expressed in gauge pressure) 2 .

[0421] In order to keep the pressure in the tank at about 2.5kg / cm 2 , remove water to the outsid...

Embodiment 2

[0427] Using the polyamide obtained in [Example 1] above, "solid phase polymerization" was further implemented.

[0428] 10 kg of polyamide pellets obtained by the prepolymer-solid-state polymerization method were charged into a conical belt vacuum dryer (manufactured by Okawara Seisakusho Co., Ltd., trade name リボコーン RM-10V) and fully replaced with nitrogen.

[0429] Heating was performed at 260° C. for 6 hours while stirring while blowing nitrogen gas at 1 L / min. Then, the temperature was lowered while flowing nitrogen gas, and when it reached about 50° C., the pellets were taken out from the apparatus as they were to obtain a polyamide.

[0430] The measurements of (1) to (10) above were performed on the obtained polyamide.

[0431] The measurement results are shown in Table 2.

Embodiment 3～6

[0433] As (a) dicarboxylic acid, (b) diamine, and additives during polymerization, the compounds and amounts described in Table 1 below were used. In Example 4, acetic acid was used as an end-capping agent.

[0434] In addition, the final temperature of polymerization was set to the temperature described in Table 1.

[0435] Regarding other conditions, the polyamide was polymerized by the prepolymer / solid phase polymerization method described in Example 1.

[0436] In addition, as the temperature and time of solid phase polymerization, the temperature and time described in Table 1 below were used. Regarding other conditions, solid phase polymerization was performed in the same manner as in Example 2 above.

[0437] The measurements of (1) to (10) above were performed on the obtained polyamide.

[0438] The measurement results are shown in Table 2.

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Abstract

The invention provides a polyamide composition that exhibits high heat tolerance, stability and color stability when heated, resistance to thermal reflow, and fogging performance. A polyamide is obtained by polymerizing: (a) dicarboxylic acids, at least 50 mol% of which are alicyclic; and (b) diamines, at least 50 mol% of which have pentamethylene diamine skeletons. The polyamide contains cyclic amino end groups in an amount less than 30 [mu]eq / g.

Description

technical field [0001] The present invention relates to polyamides and polyamide compositions. Background technique [0002] Polyamides represented by polyamide 6 and polyamide 66 (hereinafter sometimes referred to as "PA6" and "PA66"), etc. have excellent molding processability, mechanical properties and chemical resistance, so they are used as automotive, electrical and It is widely used as a material for various parts such as electronics, industrial materials, and daily and household goods. [0003] In the automobile industry, as a measure to contribute to the environment, weight reduction of vehicle bodies by substituting metals is required in order to reduce exhaust gas. In order to meet this demand, polyamide materials are often used as exterior materials, interior materials, etc., and thus the level of properties required for polyamide materials such as heat resistance, strength, and appearance has been further improved. In particular, since the temperature in the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26C08K3/00C08L77/06
CPCC08K7/02C08L77/06C08G69/26C08G69/265
Inventor 家田真次寺田和范日户祐
Owner ASAHI KASEI KK
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