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A dustproof thin film assembly frame and a dustproof thin film assembly

A technology of dust-proof film components and frames, which is applied to the original parts, optics, and instruments used for photomechanical processing, and can solve the problems of long flow distance of molten metal, prone to pinholes on the surface, internal defects, etc.

Inactive Publication Date: 2013-10-23
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dust-proof membrane module frame formed by die-casting is prone to internal defects caused by entrainment of air during filling due to the long flow distance of molten metal, and defects such as pinholes on the surface are also prone to occur

Method used

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  • A dustproof thin film assembly frame and a dustproof thin film assembly
  • A dustproof thin film assembly frame and a dustproof thin film assembly
  • A dustproof thin film assembly frame and a dustproof thin film assembly

Examples

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Embodiment

[0042] Hereinafter, examples of the present invention will be described in detail, but the scope of the present invention is not limited to these examples.

[0043] (Example)

[0044] It was produced by injection molding using a carbon fiber-containing thermoplastic resin (trade name: NXMR-C-40B manufactured by Mitsubishi Rayon Corporation) containing 40% of carbon fibers with a length of 2 to 6 mm and a thickness of 5 to 7 μm in polyamide. figure 1 A rectangular pellicle frame 10 is shown. injection molded and removed from the cooled mold image 3 In the illustrated pellicle frame 10a, a gate portion 20 is formed. With respect to the pellicle frame 10 obtained by cutting the gate part 20, both end surfaces were milled by 0.2 mm with the milling cutter. Then, lightly process the edge of the pellicle frame 10 manually with sandpaper to remove the removal marks of the sprue portion 20 and the burrs on the joint surface of the mold. At this time, the vent holes 12 and the ...

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Abstract

The invention provides a resin-produced dustproof thin film assembly frame with increased rigidity. The dustproof thin film assembly frame (10) is formed by melt pressure and is formed by thermoplastic resin mixing intensity enhancer in a fiber shape. Preferably, at least the inner side surface of the dustproof thin film assembly frame (10) is covered with a resin covering film (16) with light resistance to ultraviolet light.

Description

technical field [0001] The present invention relates to a resin pellicle frame and a pellicle using the resin pellicle frame. Background technique [0002] In the manufacture of semiconductors such as LSI and VLSI, and the manufacture of liquid crystal displays, etc., it is necessary to perform photolithography in which a pattern is formed by irradiating light onto a semiconductor wafer or an original plate for liquid crystal. At this time, if dust adheres to the photomask or precision mask, the transfer pattern may be deformed, or the edges may be unclear and the substrate may be dirty. This is due to the fact that dust absorbs or refracts light. This kind of operation is usually carried out in a clean room, but it is very difficult to keep the photomask clean from time to time. Therefore, a pellicle film made by pasting a transparent pellicle film on the pellicle frame Dust film components. For example, when performing photolithography, placing the pellicle assembly on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/64
CPCG03F1/22G03F1/38G03F1/62G03F1/64G03F7/70916
Inventor 关原一敏
Owner SHIN ETSU CHEM IND CO LTD
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