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High-temperature resistant protecting film of electronic circuit board

A high temperature resistant protective film and electronic circuit board technology, applied in the direction of film/sheet adhesives, layered products, synthetic resin layered products, etc., to reduce curing temperature and curing time, reduce production costs, meet glass Intensity of the desired effect

Active Publication Date: 2013-04-03
NINGBO SOKEN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The published literature can refer to the Chinese invention patent "High Temperature Resistant Soft Substrate Protective Film" of ZL201010000451.7 (the authorized announcement number is CN101781528B), and the silicone pressure-sensitive adhesive is coated on the base layer of the protective film. The raw material is a mixture of 85%~99.4% silicone raw rubber and vinyl silicone oil, 0.2%~5% polydimethylsiloxane or silicon hydrogen modified polydimethylsiloxane, 0.2%~ Composed of 5% silane coupling agent and 0.2%~5% Pt catalyst, the protective film involved in this patent is mainly applied to glass, metal plates and plastic plates, and the organic silicon raw rubber used is mainly low-viscosity organic silicon raw rubber , the resulting protective film can only withstand temperatures below 100°C

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment one: if figure 1 As shown, the high-temperature resistant protective film for electronic circuit boards is coated with an adhesive layer 2 on a 25 μm polyimide film 3, and the formula of the adhesive layer is as follows:

[0024] A) 76472 copies of DOW CORNING;

[0025] B) 765798 copies of DOW CORNING;

[0026] C) 0.1 part of polydimethylsiloxane;

[0027] D) 1.0 parts of Pt catalyst.

[0028] Mix component A, component B, component C and component D, stir evenly, and apply coating equipment on the polyimide substrate with a coating thickness of 8-10 μm, and cure in an oven at 130°C for 2 minutes Finally, it is compounded with a fluorine release film 1 and cut into a protective film.

Embodiment 2

[0029] Embodiment 2: An electronic circuit board high temperature resistant protective film is coated with an adhesive layer on a 25 μm polyimide film, and the adhesive layer formula is as follows:

[0030] A) 76475 copies of DOW CORNING;

[0031] B) 765795 copies of DOW CORNING;

[0032] C) 1.2 parts of polydimethylsiloxane;

[0033] D) 0.1 part of Pt catalyst.

[0034] Mix component A, component B, component C and component D, stir evenly, and apply coating equipment on the polyimide substrate with a coating thickness of 8-10 μm, and cure in an oven at 130°C for 2 minutes Finally, it is compounded with a fluorine release film and cut into a protective film.

Embodiment 3

[0035] Embodiment 3: An electronic circuit board high temperature resistant protective film is coated with an adhesive layer on a 25 μm polyimide film, and the adhesive layer formula is as follows:

[0036] A) 764,710 copies of DOW CORNING;

[0037] B) 765,790 copies of DOW CORNING;

[0038] C) 1.2 parts of polydimethylsiloxane;

[0039] D) 5.0 parts of Pt catalyst.

[0040] Mix component A, component B, component C and component D, stir evenly, and apply coating equipment on the polyimide substrate with a coating thickness of 8-10 μm, and cure in an oven at 130°C for 2 minutes Finally, it is compounded with a fluorine release film and cut into a protective film.

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Abstract

The invention relates to a high-temperature resistant protecting film of an electronic circuit board. The high-temperature resistant protecting film comprises a base material layer and an adhesive layer coated on the base material layer. The high-temperature resistant protecting film is characterized in that the adhesive layer is composed of the following components in parts by weight: 100 parts of mixed type organic silicon raw rubber, 0.1-5 parts of polydimethylsiloxane and 0.1-5 parts of Pt catalyzer. Compared with the prior art, according to the high-temperature resistant protecting film, the mixed type organic silicon raw rubber is adopted so that the protecting film can be automatically wetted and pasted on the surface of a pasted object, the protecting film can not contract or raise after being pasted for more than 200 hours at the high temperature of 250 DEG C, and the surface of the pasted object does not have oxidation, pollution or residual adhesive.

Description

technical field [0001] The invention relates to a protective film which can be used for the protection of electronic circuit boards. Background technique [0002] With the vigorous development of electronic technology, electronic equipment such as mobile phones, digital cameras, LCD TVs, and notebook computers are changing with each passing day. As an important carrier of electronic equipment and a basic material for electronic interconnection, electronic circuit boards are developing towards miniaturization and high functionality. Some processes in the manufacture of electronic circuit boards require high temperatures above 250°C (for more than 200 hours). When a specific area of ​​the circuit board is processed at high temperature, the remaining parts need to be covered with a protective film. [0003] Existing protective films mainly use rubber-type adhesives or acrylic-type adhesives, and such protective films cannot withstand temperatures of 250°C or higher. In this wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B7/12C09J7/02C09J183/04
Inventor 朱敏芳金君波徐琰谢琼颖
Owner NINGBO SOKEN CHEM
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