Method for preparing graphene or ultrathin carbon film by PVD (physical vapor deposition) technique
A graphene, ultra-thin technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve problems such as unfavorable energy saving and environmental protection, small output size, generation of exhaust gas, etc., to reduce energy and resource consumption , the shape and size requirements are small, the effect of good industrial prospects
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Embodiment 1
[0027] The preparation process in this example is as follows: first, the substrate is placed on the substrate holder in the deposition chamber, and the substrate surface Perform glow cleaning for 20 minutes; then, under the conditions of argon environment and substrate bias -200V, a mixed gas of acetylene and argon is introduced into the deposition chamber, the pressure is 0.55 Pa, the flow rate of acetylene in the mixed gas is 10 sccm, and the argon The flow rate of the gas is 70sccm; the ion source of the anode layer is turned on to ionize the mixed gas, the voltage is 450V during the ionization, the ion source of the anode layer generates a stable ionization current of 1.4A, and the acetylene is ionized to produce carbon-containing cations, and the cations are in the Under the action of an electric field, the substrate is bombarded and deposited on the substrate. The deposition time is 10 minutes. During the deposition process, the substrate rotates with the substrate holder...
Embodiment 2
[0030]The preparation process in this example is as follows: first, the substrate is placed on the substrate holder in the deposition chamber, under the conditions of 90°C, argon atmosphere, vacuum degree of 2.5Pa, and substrate bias of -800V, the surface of the substrate is Perform glow cleaning for 20 minutes; after the glow cleaning of the substrate surface is completed, open the multi-arc target under the conditions of argon atmosphere, substrate bias voltage -100V, and vacuum degree of 0.7 Pa. The target material is high-purity metal copper. The voltage on the metal target is 20V, the current is 40A, the metal is deposited on the surface of the substrate to form a metal catalyst layer, the deposition time is 10min, and the copper metal target is turned off. Then, under the conditions of argon environment and substrate bias-200V, a mixed gas of acetylene and argon is introduced into the deposition chamber, the air pressure is 0.8 Pa, the flow rate of acetylene in the mixed ...
Embodiment 3
[0032] The preparation process in this example is as follows: firstly, the substrate is placed on the substrate holder in the deposition chamber, and the substrate surface Perform glow cleaning for 20 minutes; after the glow cleaning of the substrate surface is completed, open the multi-arc target under the conditions of argon environment, substrate bias voltage -200V, and vacuum degree of 0.5 Pa. The target material is high-purity nickel metal. The voltage on the metal target is 20V, the current is 100A, the metal is deposited on the surface of the substrate to form a metal catalyst layer, the deposition time is 10min, and the copper metal target is turned off. Then, under the condition of argon environment and substrate bias voltage -200V, a mixed gas of acetylene and argon is introduced into the deposition chamber, the pressure is 0.6Pa, the flow rate of acetylene in the mixed gas is 20 sccm, and the flow rate of argon gas is 60 sccm; Turn on the ion source of the anode lay...
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