A kind of acidic molybdenum aluminum molybdenum etching solution and preparation technology thereof
A preparation process and etching solution technology, which is applied in the field of acid molybdenum aluminum molybdenum etching solution and its preparation process, can solve the problem of affecting product yield, difficulty in controlling the etching angle and etching amount of different metal layers, affecting the image accuracy of high-density thin wires and Quality and other issues, to achieve the effect of stable response, smooth lines and clean surface
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Embodiment 1
[0025] (1) Composition and preparation of acid molybdenum aluminum molybdenum etching solution
[0026] The acidic molybdenum-aluminum-molybdenum etching solution comprises phosphoric acid, acetic acid, nitric acid, cationic surfactant, metal nitrate and pure water, and the raw material weight percentages of the said molybdenum-aluminum-molybdenum etching solution are respectively: phosphoric acid 60%, acetic acid 8%, nitric acid 7% , metal nitrate 1%, cationic surfactant 0.5%, and the rest is pure water.
[0027] Wherein, the metal nitrate is potassium nitrate, and the purity of the potassium nitrate is higher than 99.5%.
[0028] Wherein, the concentrations of phosphoric acid, acetic acid and nitric acid are respectively: phosphoric acid 84%, acetic acid 99.5%, nitric acid 68%.
[0029] Wherein, the cationic surfactant is polyacrylamide.
[0030] Wherein, in the molybdenum-aluminum-molybdenum etching solution, there are 800 particles with a particle size greater than 0.3 μ...
Embodiment 2
[0047] The acidic molybdenum-aluminum-molybdenum etching solution comprises phosphoric acid, acetic acid, nitric acid, cationic surfactant, metal nitrate and pure water, and the raw material percentages by weight of the described molybdenum-aluminum-molybdenum etching solution are respectively: phosphoric acid 65%, acetic acid 11%, nitric acid 4% , metal nitrate 0.3%, cationic surfactant 0.1%, and the rest is pure water.
[0048] Wherein, the metal nitrate is potassium nitrate, and the purity of the potassium nitrate is higher than 99.5%.
[0049] Wherein, the concentrations of phosphoric acid, acetic acid and nitric acid are respectively: phosphoric acid 84%, acetic acid 99.5%, nitric acid 68%.
[0050] Wherein, the cationic surfactant is benzalkonium chloride.
[0051] Wherein, in the molybdenum-aluminum-molybdenum etching solution, there are 700 particles with a particle size greater than 0.3 μm per 1000 kg, impurity cations are 25 ppb, and impurity anions are 0.02 ppb.
...
Embodiment 3
[0055] The acidic molybdenum-aluminum-molybdenum etching solution comprises phosphoric acid, acetic acid, nitric acid, cationic surfactant, metal nitrate and pure water, and the raw material weight percentages of the said molybdenum-aluminum-molybdenum etching solution are respectively: phosphoric acid 70%, acetic acid 15%, nitric acid 1% , metal nitrate 0.1%, cationic surfactant 0.001%, and the rest is pure water.
[0056] Wherein, the metal nitrate is potassium nitrate, and the purity of the potassium nitrate is higher than 99.5%.
[0057] Wherein, the concentrations of phosphoric acid, acetic acid and nitric acid are respectively: phosphoric acid 84%, acetic acid 99.5%, nitric acid 68%.
[0058] Wherein, the cationic surfactant is benzalkonium bromide.
[0059] Wherein, in the molybdenum-aluminum-molybdenum etching solution, there are 500 particles with a particle size greater than 0.3 μm per 1000 kg, impurity cations are 20 ppb, and impurity anions are 0.03 ppb.
[0060] T...
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