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Laminate

A laminate and adhesive layer technology, applied in the direction of layered products, semiconductor devices, electric solid devices, etc., can solve the problems of reduced photoelectric conversion efficiency, poor packaging, and reduced light transmittance of laminates, and achieve photoelectric conversion efficiency Reduction suppression, reduction of transparency reduction, effect of high transparency

Inactive Publication Date: 2013-08-14
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the laminated body obtained by the above method has the following problem: when the thermoplastic resin is cooled after heating and pressing, the thermoplastic resin will cure and shrink, causing "warping" of the laminated body. Poor packaging is likely to occur when using
However, since this anchor coating agent causes whitening and reduces the light transmittance of the laminate, there is a problem that the photoelectric conversion efficiency decreases when used for encapsulation of photoelectric conversion elements and surface protection.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0090] Preparation Example 1 (Preparation of Adhesive Layer (1))

[0091] 69 parts by weight of 2-ethylhexyl acrylate (2EHA), 30 parts by weight of 2-methoxyethyl acrylate (2MEA), 1 part by weight of 4-hydroxybutyl acrylate (4HBA) and 1 part by weight 0.05 parts by weight of the trade name "IRGACURE184" manufactured by Ciba Specialty Chemicals Inc. and 0.05 parts by weight of the trade name "IRGACURE651" manufactured by Ciba Specialty Chemicals Inc. were compounded as a photopolymerization initiator in a mixture of acrylic acid (AA), and then Ultraviolet rays were irradiated until the viscosity (BH viscometer No. 5 spindle, 10 rpm, measurement temperature 30° C.) reached about 20 Pa·s to prepare a prepolymer composition in which a part of the above-mentioned monomer components were polymerized.

[0092] 0.01 parts by weight of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane [manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD C" was added to 100 parts by weight...

preparation example 2

[0096] Preparation Example 2 (Preparation of Adhesive Layer (2))

[0097] Use 1,6-hexamethylene diisocyanate [manufactured by Asahi Kasei Chemicals Corporation, trade name “DURANATE] instead of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane [Mitsubishi Gas Chemical Company manufacture, brand name "TETRAD C"], and obtained the adhesive layer (2) (with a separator) in the same manner as in Preparation Example 1.

preparation example 3

[0098] Preparation Example 3 (Preparation of Thermoplastic Resin Layer (1))

[0099] Heat and melt EVA [manufactured by DuPont-Mitsui Polychemicals Co., Ltd., trade name "EVAFLEX EV550", melting point: 89°C] at a temperature of 180°C, and extrude by T-die molding so that the final thickness (adhesive layer thickness) reaches 400 μm, and is dried to form a thermoplastic resin layer (1) with a total light transmittance of 90%.

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PUM

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Abstract

Provided is a laminate of a thermoplastic resin layer and a base, which has excellent transparency and is free from the occurrence of "warping". The laminate is suitable for sealing and surface protection of photoelectric conversion elements. This laminate is obtained by bonding a base and a thermoplastic resin layer that has a thickness larger than 200 [mu]m but 500 [mu]m or less with an adhesive layer being interposed therebetween. The 180 DEG peel strength at 23 DEG C of the thermoplastic resin layer with respect to the adhesive layer is not less than 1.0 N / 25 mm. It is preferable that the total light transmittance of the laminate is not less than 80%.

Description

technical field [0001] The present invention relates to a laminate in which a thermoplastic resin and a substrate are laminated via an adhesive layer. The laminate of the present invention is suitable for encapsulation and surface protection of photoelectric conversion elements. Background technique [0002] Photoelectric conversion elements such as solar cells and LEDs have p-type semiconductors and n-type semiconductors, and use the photoelectric conversion effect of the pn junction in the depletion layer. Solar cells can directly convert solar energy into electrical energy, and LEDs can convert electrical energy into light energy. [0003] The functions of the aforementioned p-type semiconductors and n-type semiconductors are degraded when they come into direct contact with the outside air. Therefore, it is preferable to encapsulate them with a transparent encapsulating material and further cover them with a transparent protective film to buffer and prevent foreign matter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/04B32B27/00H01L31/042
CPCC09J133/04C09J133/08B32B27/308B32B27/32B32B17/10H01L31/048H01L33/56Y02E10/50B32B7/12B32B2307/40H01L2924/0002H01L23/29B32B2457/20B32B27/36B32B27/08B32B2551/00H01L31/0481B32B17/06Y10T428/269H01L2924/00C08F220/1808C08F220/281C08F220/20C08F220/06
Inventor 中西多公岁有满幸生新谷寿朗河边茂树生岛伸祐
Owner NITTO DENKO CORP
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