Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conductive paste and base with conductive film

A technology of conductive paste and substrate, applied in the direction of conductive materials, conductive materials, conductive materials, etc. dispersed in non-conductive inorganic materials, can solve the problem that the ITO film fails to show adhesion and the ITO film fails to show Good adhesion and other problems, to achieve the effect of excellent storage stability and good adhesion

Active Publication Date: 2015-06-17
UNKNOWN +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of using the conductive paste disclosed in Patent Document 3, in Examples described later, as described in Comparative Examples 6 and 7, good adhesion to the ITO film could not be exhibited.
In addition, in the case of using the conductive paste disclosed in Patent Document 4, as described in Comparative Examples 8 and 9 in Examples described later, good adhesion to the ITO film was not exhibited.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive paste and base with conductive film
  • Conductive paste and base with conductive film
  • Conductive paste and base with conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0173] A glass beaker was placed in a water bath whose water temperature was set at 50° C., and 50 g of polyethyleneimine (manufactured by Nippon Catalyst Co., Ltd., trade name: SP012, Mw: 1200, amine value: 1064 mgKOH / g) was added to the beaker. While vigorously stirring, 43 g of formic acid was slowly added dropwise. The above-mentioned polyethyleneimine, which was pale yellow, reacted violently while emitting smoke, and turned into a brown liquid. After completion of the dropwise addition, the mixture was stirred for 30 minutes in this state, and the product was recovered in a glass container. The weight becomes the sum of polyethyleneimine and formic acid, and the product is observed by FT-IR (manufactured by Nicolet, Avatar370). As a result, it appears at 1700cm -1 Nearby carbonyl peaks derived from carboxylic acids disappear. From this, it was confirmed that a salt of polyethyleneimine and formic acid was produced.

[0174] 3.0 g of formic acid and 9.0 g of 50 mass % ...

Embodiment 2

[0179] A glass beaker was placed in a water bath whose water temperature was set at 50° C., and polyallylamine (manufactured by Nittobo Co., Ltd., trade name: PAA-01, Mw: 1600, amine value: 1120 gKOH / g, 15 mass % aqueous solution) 50g, slowly drop formic acid 6.5g while vigorously stirring. The light yellow polyallylamine reacted violently while emitting smoke, and turned into a brown liquid. After completion of the dropwise addition, the mixture was stirred for 30 minutes in this state, and then, the product was recovered in an eggplant-shaped flask. The product was dried at 50° C. for 24 hours in an eggplant-shaped flask to obtain a formate salt of polyallylamine after drying.

[0180]Next, 12 g of surface-modified copper particles (A-1) obtained in the same manner as in Example 1 were added to a resin solution obtained by dissolving 7.4 g of phenolic resin in 4.3 g of ethylene glycol monobutyl ether acetate, and then , 0.05 g of the formate salt of the polyallylamine obta...

Embodiment 3

[0182] A polyethyleneimine formate was prepared in the same manner as in Example 1, except that the addition amount of the polyethyleneimine formate was set to 0.07 g, and a copper paste was obtained in the same manner as in Example 1 material. In addition, the compounding quantity of polyethyleneimine formate was 0.6 mass % with respect to copper particle.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

Provided is a conductive paste which exhibits good adhesion by merely being applied over an ITO film directly without the formation of a base layer and being cured thereon and is capable of forming a conductive film that has high conductivity. This conductive paste contains (A) copper particles having an average particle diameter from 10 nm to 20 µm, (B) a carboxylic acid salt of a polymer compound that has at least one primary amino group in each molecule (provided that the carboxylic acid has 10 or less carbon atoms including the carbon atoms of the carbonyl group) and (C) a resin that has an acidic functional group that is reactive with the primary amino group. Specifically, the polymer compound that has primary amino group(s) is preferably a polyethylene imine or a polyallyl amine. In addition, the carboxylic acid salt thereof is preferably a formic acid salt.

Description

technical field [0001] The present invention relates to an electroconductive paste and a substrate with an electroconductive film using the same. Background technique [0002] Conventionally, the method of forming wiring conductors, such as an electronic component and a printed wiring board, using an electroconductive paste is known. Among them, the production of the printed wiring board is performed by applying and curing a conductive paste in a desired pattern shape on an insulating base material to form a wiring pattern. [0003] As an electroconductive paste, from a viewpoint of improving the reliability of an electronic device and a wiring board, the technique of using a copper paste instead of the silver paste which has silver as a main component has been proposed. The copper paste is not easy to migrate, so it can improve the connection reliability of the circuit. [0004] The above-mentioned printed wiring boards and the like are required to have various characteri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22C08L39/06C08L61/04C08L79/02H01B1/00H05K1/09H05K3/12
CPCC08G73/0206C08K3/11C08K13/04C09D5/24C09D7/67C09D7/69C09D161/04C09D179/02H01B1/22H05K1/095C08K3/08C08L61/04C08L79/02C08L39/06
Inventor 平社英之诹访久美子
Owner UNKNOWN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com