Ultraviolet selective silicon avalanche photoelectric detection chip
A selective, chip-based technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of high difficulty in making substrate materials, chip manufacturing process, difficulty in mass production, and high cost, and achieve the effect of avalanche multiplication
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[0013] refer to figure 1 . First, according to the calculation of the absorption coefficient of silicon materials in the ultraviolet (λ≤400 nm) band, the absorption length of silicon materials in the ultraviolet wavelength λ≤400 nm band is less than 0.1 μm. In order to achieve high quantum efficiency detection of silicon in the ultraviolet band, the thickness of the light-absorbing layer 4 must be greater than 100 nm, so as to prevent the photo-generated carriers from entering the high-field N-type layer in the reverse-biased depletion state before recombining near the surface 3. Under the acceleration of the electric field, a collision ionization effect is generated to realize the avalanche multiplication of photogenerated carriers. Secondly, considering the absorption of silicon materials beyond the wavelength range of ultraviolet λ≤400 nm, this embodiment designs P + The deep diffusion region 6 penetrates the entire N - epitaxial layer 2, and the P connected to the N+ oh...
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