Ultralow-friction silicon-aluminum double-element mixed amorphous carbon film preparing method
A binary doping, ultra-low friction technology, applied in ion implantation plating, gaseous chemical plating, coating, etc., to achieve good wear resistance, good elasticity, and reduce the friction coefficient
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[0023] Clean the substrate: First, ultrasonically clean the monocrystalline silicon wafer (N100 type silicon wafer) with absolute ethanol and acetone solution for 10 minutes respectively, dry it with nitrogen and place it in the reaction chamber of the magnetron sputtering deposition system; vacuumize: use high-efficiency The molecular pump evacuates the reaction chamber; substrate surface treatment: when the vacuum degree is higher than 5×10 -4 Pa, pass argon gas in the deposition chamber, and use argon (Ar) plasma to sputter and clean the single crystal silicon wafer for about 10 -20min, to remove the oxide layer and other impurities on the surface; Deposition: Methane gas and argon gas are mixed in the ratio of 1:7 and then passed into the reaction chamber, and the working pressure is opened under the condition of 0.5-1.2Pa RF power supply (power 400-700W), jointly sputtering a mixed target composed of aluminum and silicon (the area ratio is A 铝 / A 硅 =1 / 8), and at the sam...
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