Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof

Abstract

The invention discloses a composite electromagnetic-shielding copper clad laminate with a heat conduction effect and a manufacture method of the composite electromagnetic-shielding copper clad laminate. The composite electromagnetic-shielding copper clad laminate, manufactured by utilizing the manufacture method, comprises a copper foil layer, an insulated polymer layer, a metal shielding layer, an electric conduction glue layer and a sixth stacking layer which are sequentially overlapped, wherein the sixth stacking layer is a metal layer or a release material layer. The composite electromagnetic-shielding copper clad laminate simultaneously has high heat dissipation and electromagnetic-shielding functions, can be applied to electronic products with relatively strict requirements on electromagnetic compatibility and is further used for solving the problem that the heat of electronic products cannot be timely dissipated. According to the composite electromagnetic-shielding copper clad laminate with the heat conduction effect and the manufacture method of the composite electromagnetic-shielding copper clad laminate with the heat conduction effect, a mode for using a conventional copper foil base material in a manner of being matched with shielding films and radiating electronic components is replaced, and original combination of multiple materials is replaced by a composite material, so that the material cost is saved, the thickness of products is decreased, the production process links are decreased, and the integral size stability of the base material of the products can be better improved.

Description

technical field [0001] The invention relates to a structure of a copper foil substrate and a manufacturing method thereof, in particular to a flexible copper foil high thermal conductivity electromagnetic shielding substrate and a manufacturing method thereof for LED, FPC and other products with high heat dissipation requirements and electromagnetic shielding requirements . Background technique [0002] Due to the need to consider the insulation properties of traditional heat dissipation materials, the thickness of the product needs to be 60um to 120um to meet the insulation requirements. Therefore, the total thickness of the product will be very large, and the heat dissipation effect is not ideal. If the heat dissipation model of thermoplastic polyimide (TPI) mixed heat dissipation powder is used, although the thickness of the product can be reduced and the requirements of insulation properties can be met, but because the processing of TPI requires high temperature operatio...

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Problems solved by technology

[0007] In order to overcome the above defects, the present invention provides a composite electromagnetic shielding copper foil substrate with high thermal conductivity and its manufacturing method. The composite electromagnetic shielding copper foil substrate with high thermal conductivity of the present invention solves the problem of short, thin, dense The problem that a large amount of electromagnetic radiation and heat cannot be effectively controlled in the production process of the electronic circuit board can not only prevent the harm of electromagnetic radiation, but also effectively discharge the heat generated in the operation of the electronic circuit in time, and the present invention has high The composite electromagnetic shielding copper foil substrate with thermal conductivity replaces the traditional mode of using copper foil base material with shielding film and heat dissipation electronic components, and replaces the original combination of various materials with a composite material, saving materials cost, reduced product thickness, and saved production process

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