Preparation method of copper-clad plate

Abstract

The invention discloses a preparation method of a copper-clad plate, which comprises the following steps: (1) taking at least one prepreg, and stacking copper foils on the single side or double sides of the prepreg so as to obtain prepreg combinations; (2) taking at least one set of the prepreg combination, and placing the at least one set of the prepreg combination between upper and lower heating plates of a laminating machine to carry out laminated pressing; (3) in the stage of glue solution melting in the process of laminating, heating the periphery of the prepreg, so that a glue solution at the periphery of the prepreg achieves a high elastic state prior to a glue solution in the middle of the prepreg, wherein the relative curing degree of the glue solution in the high elastic state is over 60%; and (4) carrying out conventional laminating operation, so that the copper-clad plate can be obtained. According to the invention, a novel copper-clad plate preparation method is developed, so that the glue flowing problem in the process of laminating is prevented, and the problem that the thicknesses of four edges of the copper-clad plate are thin is effectively improved, thereby significantly improving the thickness uniformity and consistency of each part of the plate.

Description

technical field [0001] The invention relates to a method for preparing a copper-clad laminate, which belongs to the technical field of electronic materials. Background technique [0002] Copper Clad Laminate (Copper Clad Laminate, full name copper clad laminate, English abbreviation CCL), is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot pressed into a product. Copper-clad laminates are the basic materials of the electronics industry and are mainly used for processing and manufacturing printed circuit boards (PCBs). [0003] With the development of "light", "small", "thin" and "fast" terminal electronic products, circuit boards continue to develop in the direction of denser lines and thinner layers, so the impedance characteristics of transmission lines and Reliability, component assembly and processing accuracy put forward more stringent control requirements, so the req...

AI Technical Summary

Problems solved by technology

The high heat-resistant tape used in this processing technology has good sealing performance, which is not conducive to the escape of small molecule volatiles generated during the crosslinking reaction; once the small molecule volatiles remain in the resin matrix of the insulating layer, it will cause subsurface defects such as resin voids. Visual defects, which have adverse effects on the dielectric properties, curing degree, moisture and heat resistance and reliability of the substrate and many other performance indicators

At the same time, each laminated layer is sealed with high heat-resistant tape, which requires manual operation, which has low work efficiency and is prone to a series of operational problems such as poor sealing and inaccurate alignment, which is not conducive to the promotion and application of large-scale production

(2) Chinese invention patent application CN102275354A discloses a manufacturing method for improving the thickness uniformity of copper clad laminates. It mainly uses prepregs with different resin curing degrees in the middle and edges, so as to improve the glue flow problem in the lamination process of copper clad laminates. Prepregs The curing degree of the resin in the surrounding edge area is increased from 40% to 60% to 60% to 80%; this solution can improve the glue flow problem of the copper clad laminate, but it is difficult to produce this kind of special prepreg with the current existing manufacturing equipment. If the heating device is used synchronously during the shearing process of the packaged prepreg to cure the edge of the prepreg, but the shearing speed is too fast to achieve the required degree of curing, and it cannot be cured around the whole prepreg, so this solution cannot be used in industrial production. Apply on

However, this method only controls the resin content of the radial edges on both sides, and cannot control the resin content of the surrounding edges.

[0006] To sum up, none of the existing methods can really solve the problem of uniformity of copper clad laminate thickness, and it is difficult to realize the application in industrial production.

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