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Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method

A technology for electroplating diamond and diamond, applied in metal sawing equipment, metal processing equipment, stone processing equipment, etc., can solve the problems of chip blocking, damage, saw wire failure, etc. The effect of utilization

Active Publication Date: 2013-05-15
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the surface of the existing electroplated diamond wire saw has no special chip removal space, and the abrasive is basically covered with the entire surface of the saw wire, which is prone to chip blockage, resulting in the failure of the saw wire, and may lead to broken wires and workpieces Destruction and other processing accidents, design an electroplated diamond wire saw with controllable arrangement of abrasives with chip removal grooves, and invent a corresponding preparation method at the same time

Method used

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  • Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method
  • Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method
  • Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method

Examples

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Effect test

Embodiment 1

[0027] like figure 1 , 3 , 4 shown.

[0028] An electroplated diamond wire saw with a controllable arrangement of abrasives. The material of the steel wire matrix is ​​piano steel wire or spring steel wire. The particle size of diamond abrasive is 10~100μm. Diamond abrasives are spirally arranged on the surface of the steel wire matrix, such as figure 1 shown. figure 1 The preparation method of the electroplated diamond wire saw shown is:

[0029] (1) The selective coating treatment on the surface of the steel wire substrate is completed through a rotating spray wheel, and the paint flows out from the spray nozzle protruding from the spray wheel. The liquid wax or insulating glue flows out from the spray nozzle, solidifies after encountering the surface of the substrate with a lower temperature, and solidifies on the surface of the substrate, such as image 3 As shown, the steel wire substrate moves in a straight line at a uniform speed, and the spraying wheel rotates, a...

Embodiment 2

[0033] like figure 2 , 5 , 6 shown.

[0034] An electroplated diamond wire saw with a controllable arrangement of abrasives. The material of the steel wire matrix is ​​piano steel wire or spring steel wire. The particle size of diamond abrasive is 10~100μm. The diamond abrasives are arranged on the surface of the steel wire matrix in the form of nodules, such as figure 2 shown. figure 2 The preparation method of the electroplated diamond wire saw shown is:

[0035] (1) The selective coating treatment on the surface of the steel wire substrate is completed through a rotating spray wheel, and the paint flows out from the spray nozzle protruding from the spray wheel. The liquid wax or insulating glue flows out from the spray nozzle, solidifies after encountering the surface of the substrate with a lower temperature, and solidifies on the surface of the substrate, such as Figure 5 As shown, the steel wire stationary spraying wheel rotates one revolution to complete the s...

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Abstract

The invention discloses an electroplating diamond fretsaw with grinding materials controllably distributed and a preparation method. The electroplating diamond fretsaw is composed of a steel wire base body and diamond grinding materials, and is characterized in that the diamond grinding materials on the fretsaw are electrically deposited on a surface of the steel wire base body according to a pre-arranged shape, and a chip removal groove is formed on a none-deposited-diamond surface of the grinding materials. The preparation method comprises the following critical steps: region selection and coating processing are conducted on the surface of the steel wire base body, and a reserved none-grinding-material surface of the steel wire base body is coated with a pre-arranged shape; sand-feeding process is conducted on surfaces of the steel wire base body, the steel wire base body enters an electroplating groove, and the diamond grinding materials are electrically deposited on an uncoated region of the base body; and coating removal processing is conducted on the surface of the steel wire base body, the steel wire base body enters a coating removal groove to remove the coating, and manufacturing of the diamond fretsaw is finished. The electroplating diamond fretsaw with the grinding materials controllably distributed and the preparation method have the advantages of being high in cutting efficiency, long in service life and the like.

Description

technical field [0001] The invention relates to a preparation method for the manufacture of abrasive abrasives, especially a diamond wire saw with a chip removal groove and its preparation method, specifically an electroplated diamond wire saw with controllable arrangement of abrasives and its preparation method . Background technique [0002] At present, with the rapid development of the technology industry, the demand for cutting and processing of precious hard and brittle crystals such as sapphire is increasing day by day. Traditional cutting methods include steel sheet cutting, band saw cutting, and internal and external circular saw cutting, etc., which have defects such as wide kerf, low material yield, poor surface shape accuracy, and deep surface damage. Large-scale precision thin section cutting of hard and brittle crystal substrates. Consolidated abrasive diamond wire saw cutting has the advantages of less damage to the processed surface, less deflection defo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B28D5/04B23D61/18
Inventor 孙玉利曹连静左敦稳李瑞向进赵鹏
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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