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Metal-clad laminated plate

A laminated board and metal-clad technology, which is applied in the direction of metal layered products, metal pattern materials, and the improvement of metal adhesion on insulating substrates, can solve problems such as insufficient signal transmission characteristics, and achieve excellent interlayer adhesion and high performance. Low impedance matching, satisfying quality effect

Active Publication Date: 2014-06-04
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the laminate described in this document, in order to increase the interlayer adhesive strength (peel strength) between the liquid crystal polymer film and the metal foil, the surface roughness Rz is increased to the surface in contact with the liquid crystal polymer of the metal foil. Roughening is performed by forming protrusions in the range of 2.5 to 4.0 μm, but there is a problem that the signal transmission characteristics in the high-frequency region are still insufficient.

Method used

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  • Metal-clad laminated plate
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~3

[0056] Electrolytic copper foil 1 with a thickness of 12 μm was laminated on both sides of a liquid crystal polymer film (manufactured by Japan Goatex Co., Ltd., trade name BIAC, heat distortion temperature: 300° C.) with a thickness of 50 μm and a film thickness tolerance of 5.0%. The metal-clad laminates according to Example 1 were produced by continuous thermocompression bonding between the clad metal pressure rolls. Also, using electrolytic copper foils 2 and 3 with a thickness of 12 μm, both surfaces of the liquid crystal polymer film were continuously thermocompression-bonded in the same manner as above to manufacture metal-clad laminates according to Examples 2 and 3.

[0057] Specifically, both the above-mentioned liquid crystal polymer film and the above-mentioned electrolytic copper foil were made of elongated roll materials, and were placed in a thermostatic chamber during lamination, and the surface temperature was set to 240°C (the temperature difference in the wid...

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PUM

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Abstract

Provided is a metal-clad laminated plate, wherein dielectric-thickness tolerance that contributes to characteristic-impedance tolerance is made to be low to deal with the tendency of transmission frequency becoming higher, and wherein transmission loss of signals at high-frequency ranges is small. The metal-clad laminated plate comprises a metal foil on one face or on both faces of a liquid crystal polymer layer, and is characterized in that the metal foil has protrusions formed on the surface layer thereof, by having a face thereof that comes in contact with the liquid crystal polymer layer roughened, and the aspect ratio (H / L) of the protrusions, indicated by the ratio of the height (H) thereof with respect to the width (L) of the base sections thereof, is within a range of 3-20. The metal-clad laminated plate is also characterized in that the height of the protrusions is within a range of 0.1-2 µm, the thickness of the liquid crystal polymer layer is 10-200 µm, and the film-thickness tolerance thereof is less than 6%.

Description

technical field [0001] The present invention relates to a metal-clad laminate. Specifically, it relates to a metal-clad laminate having a liquid crystal polymer layer and having excellent high-frequency electrical characteristics. Background technique [0002] Currently, many electronic devices are restricted by space inside the device due to miniaturization and weight reduction, and flexible circuit boards (hereinafter, referred to as FPCs) that can bend wiring and boards are often used. And recently, with the high performance of equipment, it is necessary to cope with the high frequency of transmission signals. [0003] Conventionally, in an electronic circuit used at an operating speed of about MHz, as long as the wiring to be connected to the FPC is correctly wired on the substrate, there will be no problem in operation. However, when the operating speed of the electronic circuit is increased, it is not sufficient only under the above-mentioned required conditions, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38B32B15/08H05K1/03
CPCB32B15/20H05K1/0237H05K3/382H05K3/022H05K2201/0141B32B15/08B32B27/06B32B2307/204B32B2307/538B32B2307/732H05K1/09
Inventor 冈崎有起安藤慎悟荒井昭平
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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