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Solvent-free polyurethane compound adhesive and preparation method thereof

A solvent-free polyurethane and composite adhesive technology, which is applied in the field of polymer chemistry, can solve the problems that the composite film does not meet the retort sterilization resistance, poor high temperature resistance and durability, and the peeling strength needs to be improved, and achieves good adhesion. , The effect of good adhesion and increased production speed

Active Publication Date: 2014-04-16
常熟国和新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the molecular weight of solvent-free adhesives is much smaller than that of solvent-based adhesives and poor wettability, etc., when used to bond composite films containing aluminum foil and other metal foils, the adhesiveness will decrease after high-temperature sterilization, and The yellowing of the colloid affects the appearance and other problems, showing poor high temperature resistance and durability
[0004] The CN101503611A patent document discloses a two-component solvent-free polyurethane adhesive, which exhibits low water absorption, low hydrolysis, and high impact resistance, but the scope of the composite base material is narrow, and the composite film made by the adhesive does not meet the requirement of retort resistance. Sterilization requirements
The CN101280167B patent document discloses a solvent-free polyurethane laminating adhesive coated at room temperature. The prepared composite film can withstand boiling at 100°C for 30 minutes, but the scope of the composite base material is narrow, and the peel strength needs to be improved

Method used

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  • Solvent-free polyurethane compound adhesive and preparation method thereof
  • Solvent-free polyurethane compound adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1: the preparation of curing agent-1

[0045] Heat 120 parts of polyoxypropylene diol with a molecular weight of 400 to 120°C and dehydrate for 1 hour at a vacuum of 0.25KPa; when the temperature drops to 40°C, stir and add 40 parts of epoxy resin (E-44), 30 parts of trimellitic anhydride, 10 After stirring evenly, raise the temperature to 60°C and heat and stir for 3 hours to obtain an epoxy resin-modified polyether polyol. Hereinafter referred to as curing agent-1.

Embodiment 2

[0046] Embodiment 2: the preparation of curing agent-2

[0047] Heat 105 parts of polyoxypropylene triol with a molecular weight of 300 to 125°C and dehydrate for 1 hour at a vacuum of 0.25KPa; when the temperature drops to 40°C, stir and add 27 parts of epoxy resin (E-44), 15 parts of trimellitic anhydride, 3 After stirring evenly, heat up to 100°C and stir for 2.5 hours to prepare epoxy resin-modified polyether polyol. Hereinafter referred to as curing agent-2.

Embodiment 3

[0048] Embodiment 3: the preparation of curing agent-3

[0049]Heat 40 parts of polyoxypropylene triol with a molecular weight of 300 and 120 parts of polyoxypropylene diol with a molecular weight of 400 to 125°C, dehydrate for 2 hours at a vacuum of 0.25KPa; drop the temperature to 45°C, and add 26 parts of epoxy Resin (E-44), 10 parts of trimellitic anhydride, and 4 parts of phosphoric acid were evenly stirred, then heated to 120°C and stirred for 2 hours to prepare epoxy resin-modified polyether polyol. Hereinafter referred to as curing agent-3.

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Abstract

The invention provides a solvent-free polyurethane compound adhesive which is composed of two constituents, namely, a main agent and a curing agent, wherein the main agent is polyether polyol modified by epoxy resin, and the curing agent is end isocyanate-group polyurethane prepolymer. The main agent and the curing agent are mixed in a ratio of 1.0 / 1.5 of -OH / -NCO. The solvent-free polyurethane compound adhesive is suitable for compounding among various films and excellent in adhesion property; and moreover, the prepared compound film can still keep a good appearance after high-temperature sterilization treatment.

Description

technical field [0001] The invention belongs to the field of polymer chemistry, and in particular relates to a solvent-free polyurethane composite glue and a preparation method thereof. technical background [0002] At present, most of the composite films used in food flexible packaging in my country are mainly bonded by solvent-based adhesives, and are laminated by dry lamination process. Due to the high energy consumption, large VOC emissions, and solvent residues in the lamination process, food safety is seriously threatened. Due to its high solid content, solvent-free polyurethane adhesives are safe to use and environmentally friendly, and will be an inevitable trend in the development of packaging lamination processes. [0003] Solvent-free composite adhesives, including two types of one-component polyurethane adhesives and two-component polyurethane adhesives. Since the molecular weight of solvent-free adhesives is much smaller than that of solvent-based adhesives and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/08C08G18/75C08G18/32C08G59/14C08G59/16
Inventor 钟文军徐大勇
Owner 常熟国和新材料有限公司
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